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Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

(2015) MICROELECTRONIC ENGINEERING. 140(140). p.72-80
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Metallization and barrier materials, 3D interconnects, INTERFACIAL REACTIONS, Lead-free solders, Cobalt-Tin intermetallics (Co-Sn IMC), Cobalt-Tin (Co-Sn)

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Citation

Please use this url to cite or link to this publication:

Chicago
Vakanas, George, O Minho, Biljana Dimcic, Kris Vanstreels, and Bjorn Vandecasteele. 2015. “Formation, Processing and Characterization of Co–Sn Intermetallic Compounds for Potential Integration in 3D Interconnects.” Microelectronic Engineering 140 (140): 72–80.
APA
Vakanas, G., Minho, O., Dimcic, B., Vanstreels, K., & Vandecasteele, B. (2015). Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects. MICROELECTRONIC ENGINEERING, 140(140), 72–80.
Vancouver
1.
Vakanas G, Minho O, Dimcic B, Vanstreels K, Vandecasteele B. Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects. MICROELECTRONIC ENGINEERING. Elsevier BV; 2015;140(140):72–80.
MLA
Vakanas, George, O Minho, Biljana Dimcic, et al. “Formation, Processing and Characterization of Co–Sn Intermetallic Compounds for Potential Integration in 3D Interconnects.” MICROELECTRONIC ENGINEERING 140.140 (2015): 72–80. Print.
@article{6914188,
  author       = {Vakanas, George and Minho, O and Dimcic, Biljana and Vanstreels, Kris and Vandecasteele, Bjorn},
  issn         = {0167-9317},
  journal      = {MICROELECTRONIC ENGINEERING},
  language     = {eng},
  number       = {140},
  pages        = {72--80},
  publisher    = {Elsevier BV},
  title        = {Formation, processing and characterization of Co--Sn intermetallic compounds for potential integration in 3D interconnects},
  url          = {http://dx.doi.org/10.1016/j.mee.2015.04.116},
  volume       = {140},
  year         = {2015},
}

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