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Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films

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Pore stuffing, DIELECTRIC-CONSTANT MATERIALS, Pore sealing, Low-k, Self-assembled monolayer, SAM, SELF-ASSEMBLED MONOLAYERS, LOW-K DIELECTRICS, POROUS SIOCH, MICROELECTRONICS, DEPOSITION, EFFICIENCY

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Citation

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Chicago
Sun, Yiting, Elisabeth Levrau, Liping Zhang, Jef Geypen, Johan Meersschaut, Alexis Franquet, Quoc Le Le, et al. 2015. “Stuffing-enabled Surface Confinement of Silanes Used as Sealing Agents on CF4 Plasma-exposed 2.0 p-OSG Films.” Microelectronic Engineering 137: 70–74.
APA
Sun, Yiting, Levrau, E., Zhang, L., Geypen, J., Meersschaut, J., Franquet, A., Le, Q. L., et al. (2015). Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films. MICROELECTRONIC ENGINEERING, 137, 70–74.
Vancouver
1.
Sun Y, Levrau E, Zhang L, Geypen J, Meersschaut J, Franquet A, et al. Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films. MICROELECTRONIC ENGINEERING. 2015;137:70–4.
MLA
Sun, Yiting, Elisabeth Levrau, Liping Zhang, et al. “Stuffing-enabled Surface Confinement of Silanes Used as Sealing Agents on CF4 Plasma-exposed 2.0 p-OSG Films.” MICROELECTRONIC ENGINEERING 137 (2015): 70–74. Print.
@article{6868183,
  author       = {Sun, Yiting and Levrau, Elisabeth and Zhang, Liping and Geypen, Jef and Meersschaut, Johan and Franquet, Alexis and Le, Quoc Le and de Marneffe, Jean-Fran\c{c}ois and Bender, Hugo and Struyf, Herbert and Detavernier, Christophe and Baklanov, Mikhail and De Feyter, Steven and Armini, Silvia},
  issn         = {0167-9317},
  journal      = {MICROELECTRONIC ENGINEERING},
  language     = {eng},
  pages        = {70--74},
  title        = {Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films},
  url          = {http://dx.doi.org/10.1016/j.mee.2014.11.001},
  volume       = {137},
  year         = {2015},
}

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