In situ scanning tunneling microscopy study of the intergranular corrosion of copper
- Author
- E Martinez-Lombardia, Linsey Lapeire (UGent) , V Maurice, Iris De Graeve (UGent) , Kim Verbeken (UGent) , LH Klein, Leo Kestens (UGent) , P Marcus and H Terryn
- Organization
- Keywords
- Corrosion, Grain boundary, TEMPERATURE, Copper, ECSTM, ALUMINUM, CU(111), ELECTRODES, STM, FCC MATERIALS, GRAIN-BOUNDARY, DEFORMATION
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-6864082
- MLA
- Martinez-Lombardia, E., et al. “In Situ Scanning Tunneling Microscopy Study of the Intergranular Corrosion of Copper.” ELECTROCHEMISTRY COMMUNICATIONS, vol. 41, 2014, pp. 1–4, doi:10.1016/j.elecom.2014.01.007.
- APA
- Martinez-Lombardia, E., Lapeire, L., Maurice, V., De Graeve, I., Verbeken, K., Klein, L., … Terryn, H. (2014). In situ scanning tunneling microscopy study of the intergranular corrosion of copper. ELECTROCHEMISTRY COMMUNICATIONS, 41, 1–4. https://doi.org/10.1016/j.elecom.2014.01.007
- Chicago author-date
- Martinez-Lombardia, E, Linsey Lapeire, V Maurice, Iris De Graeve, Kim Verbeken, LH Klein, Leo Kestens, P Marcus, and H Terryn. 2014. “In Situ Scanning Tunneling Microscopy Study of the Intergranular Corrosion of Copper.” ELECTROCHEMISTRY COMMUNICATIONS 41: 1–4. https://doi.org/10.1016/j.elecom.2014.01.007.
- Chicago author-date (all authors)
- Martinez-Lombardia, E, Linsey Lapeire, V Maurice, Iris De Graeve, Kim Verbeken, LH Klein, Leo Kestens, P Marcus, and H Terryn. 2014. “In Situ Scanning Tunneling Microscopy Study of the Intergranular Corrosion of Copper.” ELECTROCHEMISTRY COMMUNICATIONS 41: 1–4. doi:10.1016/j.elecom.2014.01.007.
- Vancouver
- 1.Martinez-Lombardia E, Lapeire L, Maurice V, De Graeve I, Verbeken K, Klein L, et al. In situ scanning tunneling microscopy study of the intergranular corrosion of copper. ELECTROCHEMISTRY COMMUNICATIONS. 2014;41:1–4.
- IEEE
- [1]E. Martinez-Lombardia et al., “In situ scanning tunneling microscopy study of the intergranular corrosion of copper,” ELECTROCHEMISTRY COMMUNICATIONS, vol. 41, pp. 1–4, 2014.
@article{6864082,
author = {{Martinez-Lombardia, E and Lapeire, Linsey and Maurice, V and De Graeve, Iris and Verbeken, Kim and Klein, LH and Kestens, Leo and Marcus, P and Terryn, H}},
issn = {{1388-2481}},
journal = {{ELECTROCHEMISTRY COMMUNICATIONS}},
keywords = {{Corrosion,Grain boundary,TEMPERATURE,Copper,ECSTM,ALUMINUM,CU(111),ELECTRODES,STM,FCC MATERIALS,GRAIN-BOUNDARY,DEFORMATION}},
language = {{eng}},
pages = {{1--4}},
title = {{In situ scanning tunneling microscopy study of the intergranular corrosion of copper}},
url = {{http://doi.org/10.1016/j.elecom.2014.01.007}},
volume = {{41}},
year = {{2014}},
}
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