Academic Bibliography

 Search 200 years of publications by Ghent University researchers.
Advanced search
1 file | 1.94 MB
Add to list
  1. Search results
  2. In situ scanning tunneling microscopy...

In situ scanning tunneling microscopy study of grain-dependent corrosion on microcrystalline copper

E Martinez-Lombardia, V Maurice, Linsey Lapeire (UGent) , Iris De Graeve (UGent) , Kim Verbeken (UGent) , Leo Kestens (UGent) , P Marcus and H Terryn
(2014) JOURNAL OF PHYSICAL CHEMISTRY C. 118(44). p.25421-25428
Author
Organization
Abstract
In situ electrochemical scanning tunneling microscopy (ECSTM) was applied to analyze the local susceptibility to corrosion at different grains of cryogenically rolled microcrystalline copper in a HCl solution, and combined with electron backscatter diffraction (EBSD) and field emission scanning electron miscroscopy (FE-SEM) to discuss the relationship between nanometer scale corrosion resistance and crystallographic orientation. The results show that the thickness of the air-formed oxide layer is grain-dependent with the largest values exceeding locally by a factor of 2 the macroscopic value (2.8 nm) measured electrochemically. Anodic dissolution is also grain-dependent with dissolving grains observed to neighbor corrosion-resistant grains. A nearly random texture prevented an EBSD-based assignment of the crystallographic orientation of the grains observed by ECSTM. However, comparison of the etched surface morphology measured in situ by ECSTM and ex situ by FE-SEM suggested that the faster dissolving grains were oriented closer to 111 //ND or in between 111 //ND and 110 //ND while the neighboring corrosion-resistant grains were oriented closer to 001 //ND. The higher step density measured by ECSTM on the grains corroding faster despite possibly 111 //ND oriented terraces confirms the role of surface defects related to misorientation on the corrosion susceptibility.
Keywords
PURE COPPER, DROPLET CELL, SINGLE GRAINS, INITIAL-STAGES, ELECTROCHEMICAL MICROSCOPY, STM, DISSOLUTION, CU(111), ELECTRODES, CRYSTALLOGRAPHIC ORIENTATION

Downloads

  • Download
    (...).pdf
    • full text
    • |
    • UGent only
    • |
    • PDF
    • |
    • 1.94 MB

Citation

Please use this url to cite or link to this publication:

MLA
Martinez-Lombardia, E., et al. “In Situ Scanning Tunneling Microscopy Study of Grain-Dependent Corrosion on Microcrystalline Copper.” JOURNAL OF PHYSICAL CHEMISTRY C, vol. 118, no. 44, 2014, pp. 25421–28, doi:10.1021/jp507089f.
APA
Martinez-Lombardia, E., Maurice, V., Lapeire, L., De Graeve, I., Verbeken, K., Kestens, L., … Terryn, H. (2014). In situ scanning tunneling microscopy study of grain-dependent corrosion on microcrystalline copper. JOURNAL OF PHYSICAL CHEMISTRY C, 118(44), 25421–25428. https://doi.org/10.1021/jp507089f
Chicago author-date
Martinez-Lombardia, E, V Maurice, Linsey Lapeire, Iris De Graeve, Kim Verbeken, Leo Kestens, P Marcus, and H Terryn. 2014. “In Situ Scanning Tunneling Microscopy Study of Grain-Dependent Corrosion on Microcrystalline Copper.” JOURNAL OF PHYSICAL CHEMISTRY C 118 (44): 25421–28. https://doi.org/10.1021/jp507089f.
Chicago author-date (all authors)
Martinez-Lombardia, E, V Maurice, Linsey Lapeire, Iris De Graeve, Kim Verbeken, Leo Kestens, P Marcus, and H Terryn. 2014. “In Situ Scanning Tunneling Microscopy Study of Grain-Dependent Corrosion on Microcrystalline Copper.” JOURNAL OF PHYSICAL CHEMISTRY C 118 (44): 25421–25428. doi:10.1021/jp507089f.
Vancouver
1.
Martinez-Lombardia E, Maurice V, Lapeire L, De Graeve I, Verbeken K, Kestens L, et al. In situ scanning tunneling microscopy study of grain-dependent corrosion on microcrystalline copper. JOURNAL OF PHYSICAL CHEMISTRY C. 2014;118(44):25421–8.
IEEE
[1]
E. Martinez-Lombardia et al., “In situ scanning tunneling microscopy study of grain-dependent corrosion on microcrystalline copper,” JOURNAL OF PHYSICAL CHEMISTRY C, vol. 118, no. 44, pp. 25421–25428, 2014.
@article{6864038,
  abstract     = {{In situ electrochemical scanning tunneling microscopy (ECSTM) was applied to analyze the local susceptibility to corrosion at different grains of cryogenically rolled microcrystalline copper in a HCl solution, and combined with electron backscatter diffraction (EBSD) and field emission scanning electron miscroscopy (FE-SEM) to discuss the relationship between nanometer scale corrosion resistance and crystallographic orientation. The results show that the thickness of the air-formed oxide layer is grain-dependent with the largest values exceeding locally by a factor of 2 the macroscopic value (2.8 nm) measured electrochemically. Anodic dissolution is also grain-dependent with dissolving grains observed to neighbor corrosion-resistant grains. A nearly random texture prevented an EBSD-based assignment of the crystallographic orientation of the grains observed by ECSTM. However, comparison of the etched surface morphology measured in situ by ECSTM and ex situ by FE-SEM suggested that the faster dissolving grains were oriented closer to 111 //ND or in between 111 //ND and 110 //ND while the neighboring corrosion-resistant grains were oriented closer to 001 //ND. The higher step density measured by ECSTM on the grains corroding faster despite possibly 111 //ND oriented terraces confirms the role of surface defects related to misorientation on the corrosion susceptibility.}},
  author       = {{Martinez-Lombardia, E and Maurice, V and Lapeire, Linsey and De Graeve, Iris and Verbeken, Kim and Kestens, Leo and Marcus, P and Terryn, H}},
  issn         = {{1932-7447}},
  journal      = {{JOURNAL OF PHYSICAL CHEMISTRY C}},
  keywords     = {{PURE COPPER,DROPLET CELL,SINGLE GRAINS,INITIAL-STAGES,ELECTROCHEMICAL MICROSCOPY,STM,DISSOLUTION,CU(111),ELECTRODES,CRYSTALLOGRAPHIC ORIENTATION}},
  language     = {{eng}},
  number       = {{44}},
  pages        = {{25421--25428}},
  title        = {{In situ scanning tunneling microscopy study of grain-dependent corrosion on microcrystalline copper}},
  url          = {{http://doi.org/10.1021/jp507089f}},
  volume       = {{118}},
  year         = {{2014}},
}
Altmetric
View in Altmetric
Web of Science
Times cited: