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Surface modification of an epoxy resin with polyamines and polydopamine: adhesion towards electroless deposited copper

David Schaubroeck (UGent) , Lothar Mader (UGent) , Peter Dubruel (UGent) and Jan Vanfleteren (UGent)
(2015) APPLIED SURFACE SCIENCE. 353. p.238-244
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Keywords
surface modification, polyamines, Polydopamine, electroless copper, METALLIZATION, POLYMERS, adhesive strength, POLYIMIDE FILMS, POLY(TETRAFLUOROETHYLENE) FILMS, GRAFT-COPOLYMERIZATION, PLASMA TREATMENT, MICROELECTRONICS, NICKEL, LAYERS

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Citation

Please use this url to cite or link to this publication:

MLA
Schaubroeck, David et al. “Surface Modification of an Epoxy Resin with Polyamines and Polydopamine: Adhesion Towards Electroless Deposited Copper.” APPLIED SURFACE SCIENCE 353 (2015): 238–244. Print.
APA
Schaubroeck, D., Mader, L., Dubruel, P., & Vanfleteren, J. (2015). Surface modification of an epoxy resin with polyamines and polydopamine: adhesion towards electroless deposited copper. APPLIED SURFACE SCIENCE, 353, 238–244.
Chicago author-date
Schaubroeck, David, Lothar Mader, Peter Dubruel, and Jan Vanfleteren. 2015. “Surface Modification of an Epoxy Resin with Polyamines and Polydopamine: Adhesion Towards Electroless Deposited Copper.” Applied Surface Science 353: 238–244.
Chicago author-date (all authors)
Schaubroeck, David, Lothar Mader, Peter Dubruel, and Jan Vanfleteren. 2015. “Surface Modification of an Epoxy Resin with Polyamines and Polydopamine: Adhesion Towards Electroless Deposited Copper.” Applied Surface Science 353: 238–244.
Vancouver
1.
Schaubroeck D, Mader L, Dubruel P, Vanfleteren J. Surface modification of an epoxy resin with polyamines and polydopamine: adhesion towards electroless deposited copper. APPLIED SURFACE SCIENCE. 2015;353:238–44.
IEEE
[1]
D. Schaubroeck, L. Mader, P. Dubruel, and J. Vanfleteren, “Surface modification of an epoxy resin with polyamines and polydopamine: adhesion towards electroless deposited copper,” APPLIED SURFACE SCIENCE, vol. 353, pp. 238–244, 2015.
@article{6849118,
  author       = {Schaubroeck, David and Mader, Lothar and Dubruel, Peter and Vanfleteren, Jan},
  issn         = {0169-4332},
  journal      = {APPLIED SURFACE SCIENCE},
  keywords     = {surface modification,polyamines,Polydopamine,electroless copper,METALLIZATION,POLYMERS,adhesive strength,POLYIMIDE FILMS,POLY(TETRAFLUOROETHYLENE) FILMS,GRAFT-COPOLYMERIZATION,PLASMA TREATMENT,MICROELECTRONICS,NICKEL,LAYERS},
  language     = {eng},
  pages        = {238--244},
  title        = {Surface modification of an epoxy resin with polyamines and polydopamine: adhesion towards electroless deposited copper},
  url          = {http://dx.doi.org/10.1016/j.apsusc.2015.06.114},
  volume       = {353},
  year         = {2015},
}

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