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These days, there is a lot of interest for making electronic devices lighter and compacter, as the electronics market is rapidly expanding with all sorts of portable devices for home and everyday use. Here, a technology for embedding single thin chips in flexible substrates is further investigated so that several chips might be integrated within the same substrate. This technology offers the possibility of reducing weight, while at the same time enhancing the mechanical flexibility of the electronic circuitry. Such an integration is particularly interesting in the area of flexible displays, where the flexibility of the display is too often hampered by the rigidity of its driving electronics.

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Chicago
Govaerts, Jonathan, Wim Christiaens, Erwin Bosman, and Jan Vanfleteren. 2008. “Multiple Chip Integration for Flat Flexible Electronics.” In 2008 IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics and 2008 IEEE Interdisciplinary Conference on Portable Information Devices, 137–141. New York, NY, USA: IEEE.
APA
Govaerts, J., Christiaens, W., Bosman, E., & Vanfleteren, J. (2008). Multiple chip integration for flat flexible electronics. 2008 IEEE Conference on polymers and adhesives in microelectronics and photonics and 2008 IEEE interdisciplinary conference on portable information devices (pp. 137–141). Presented at the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics ; 2nd IEEE International interdisciplinary conference on Portable Information Devices, New York, NY, USA: IEEE.
Vancouver
1.
Govaerts J, Christiaens W, Bosman E, Vanfleteren J. Multiple chip integration for flat flexible electronics. 2008 IEEE Conference on polymers and adhesives in microelectronics and photonics and 2008 IEEE interdisciplinary conference on portable information devices. New York, NY, USA: IEEE; 2008. p. 137–41.
MLA
Govaerts, Jonathan et al. “Multiple Chip Integration for Flat Flexible Electronics.” 2008 IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics and 2008 IEEE Interdisciplinary Conference on Portable Information Devices. New York, NY, USA: IEEE, 2008. 137–141. Print.
@inproceedings{677893,
  abstract     = {These days, there is a lot of interest for making electronic devices lighter and compacter, as the electronics market is rapidly expanding with all sorts of portable devices for home and everyday use. Here, a technology for embedding single thin chips in flexible substrates is further investigated so that several chips might be integrated within the same substrate. This technology offers the possibility of reducing weight, while at the same time enhancing the mechanical flexibility of the electronic circuitry. Such an integration is particularly interesting in the area of flexible displays, where the flexibility of the display is too often hampered by the rigidity of its driving electronics.},
  author       = {Govaerts, Jonathan and Christiaens, Wim and Bosman, Erwin and Vanfleteren, Jan},
  booktitle    = {2008 IEEE Conference on polymers and adhesives in microelectronics and photonics and 2008 IEEE interdisciplinary conference on portable information devices},
  isbn         = {9781424421411},
  language     = {eng},
  location     = {Garmisch-Partenkirchen, Germany},
  pages        = {137--141},
  publisher    = {IEEE},
  title        = {Multiple chip integration for flat flexible electronics},
  url          = {http://dx.doi.org/10.1109/PORTABLE-POLYTRONIC.2008.4681283},
  year         = {2008},
}

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