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Modelling and IR measurements of the electronic substrate thermal conductivity

(2015) MICROELECTRONICS RELIABILITY. 55(1). p.138-142
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Keywords
Thermal conductivity, Alumina, Heat transfer, CIRCUITS

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Citation

Please use this url to cite or link to this publication:

Chicago
De Mey, Gilbert, Mariusz Felczak, and Boguslaw Wiecek. 2015. “Modelling and IR Measurements of the Electronic Substrate Thermal Conductivity.” Microelectronics Reliability 55 (1): 138–142.
APA
De Mey, G., Felczak, M., & Wiecek, B. (2015). Modelling and IR measurements of the electronic substrate thermal conductivity. MICROELECTRONICS RELIABILITY, 55(1), 138–142.
Vancouver
1.
De Mey G, Felczak M, Wiecek B. Modelling and IR measurements of the electronic substrate thermal conductivity. MICROELECTRONICS RELIABILITY. 2015;55(1):138–42.
MLA
De Mey, Gilbert, Mariusz Felczak, and Boguslaw Wiecek. “Modelling and IR Measurements of the Electronic Substrate Thermal Conductivity.” MICROELECTRONICS RELIABILITY 55.1 (2015): 138–142. Print.
@article{5889851,
  author       = {De Mey, Gilbert and Felczak, Mariusz and Wiecek, Boguslaw},
  issn         = {0026-2714},
  journal      = {MICROELECTRONICS RELIABILITY},
  keywords     = {Thermal conductivity,Alumina,Heat transfer,CIRCUITS},
  language     = {eng},
  number       = {1},
  pages        = {138--142},
  title        = {Modelling and IR measurements of the electronic substrate thermal conductivity},
  volume       = {55},
  year         = {2015},
}

Web of Science
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