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Modelling and IR measurements of the electronic substrate thermal conductivity

(2015) MICROELECTRONICS RELIABILITY. 55(1). p.138-142
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Keywords
Thermal conductivity, Alumina, Heat transfer, CIRCUITS

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Citation

Please use this url to cite or link to this publication:

MLA
De Mey, Gilbert, Mariusz Felczak, and Boguslaw Wiecek. “Modelling and IR Measurements of the Electronic Substrate Thermal Conductivity.” MICROELECTRONICS RELIABILITY 55.1 (2015): 138–142. Print.
APA
De Mey, G., Felczak, M., & Wiecek, B. (2015). Modelling and IR measurements of the electronic substrate thermal conductivity. MICROELECTRONICS RELIABILITY, 55(1), 138–142.
Chicago author-date
De Mey, Gilbert, Mariusz Felczak, and Boguslaw Wiecek. 2015. “Modelling and IR Measurements of the Electronic Substrate Thermal Conductivity.” Microelectronics Reliability 55 (1): 138–142.
Chicago author-date (all authors)
De Mey, Gilbert, Mariusz Felczak, and Boguslaw Wiecek. 2015. “Modelling and IR Measurements of the Electronic Substrate Thermal Conductivity.” Microelectronics Reliability 55 (1): 138–142.
Vancouver
1.
De Mey G, Felczak M, Wiecek B. Modelling and IR measurements of the electronic substrate thermal conductivity. MICROELECTRONICS RELIABILITY. 2015;55(1):138–42.
IEEE
[1]
G. De Mey, M. Felczak, and B. Wiecek, “Modelling and IR measurements of the electronic substrate thermal conductivity,” MICROELECTRONICS RELIABILITY, vol. 55, no. 1, pp. 138–142, 2015.
@article{5889851,
  author       = {De Mey, Gilbert and Felczak, Mariusz and Wiecek, Boguslaw},
  issn         = {0026-2714},
  journal      = {MICROELECTRONICS RELIABILITY},
  keywords     = {Thermal conductivity,Alumina,Heat transfer,CIRCUITS},
  language     = {eng},
  number       = {1},
  pages        = {138--142},
  title        = {Modelling and IR measurements of the electronic substrate thermal conductivity},
  volume       = {55},
  year         = {2015},
}

Web of Science
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