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Optimal placement of electronic devices in forced convective cooling condition

(2009) MICROELECTRONICS RELIABILITY. 49(12). p.1537-1545
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Citation

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Chicago
Felczak, Mariusz, Boguslaw Wiecek, and Gilbert De Mey. 2009. “Optimal Placement of Electronic Devices in Forced Convective Cooling Condition.” Microelectronics Reliability 49 (12): 1537–1545.
APA
Felczak, M., Wiecek, B., & De Mey, G. (2009). Optimal placement of electronic devices in forced convective cooling condition. MICROELECTRONICS RELIABILITY, 49(12), 1537–1545.
Vancouver
1.
Felczak M, Wiecek B, De Mey G. Optimal placement of electronic devices in forced convective cooling condition. MICROELECTRONICS RELIABILITY. 2009;49(12):1537–45.
MLA
Felczak, Mariusz, Boguslaw Wiecek, and Gilbert De Mey. “Optimal Placement of Electronic Devices in Forced Convective Cooling Condition.” MICROELECTRONICS RELIABILITY 49.12 (2009): 1537–1545. Print.
@article{5856661,
  author       = {Felczak, Mariusz and Wiecek, Boguslaw  and De Mey, Gilbert},
  issn         = {0026-2714},
  journal      = {MICROELECTRONICS RELIABILITY},
  language     = {eng},
  number       = {12},
  pages        = {1537--1545},
  title        = {Optimal placement of electronic devices in forced convective cooling condition},
  url          = {http://dx.doi.org/10.1016/j.microrel.2009.06.007},
  volume       = {49},
  year         = {2009},
}

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