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Evaluation of the heat transfer coefficient in microcircuits from the frequency analysis of the thermal transient response

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Abstract
In this paper, it is outlined how thermal AC measurements can be carried out on a resistor deposited on an electronic substrate. The AC approach enables us to limit ourselves to phase measurements which can be carried out with a much higher precision than amplitude measurements. It will also be demonstrated how the phase measurements at a well-chosen frequency can be used to measure the heat transfer coefficient.
Keywords
PULSED PHASE THERMOGRAPHY, LOCK-IN THERMOGRAPHY, MICROELECTRONIC STRUCTURES, NONDESTRUCTIVE EVALUATION, IMPEDANCE, DEVICES, METHODOLOGY, SIMULATION, PACKAGES, MODEL, AC thermal modeling, convective heat transfer, thermography measurements

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Citation

Please use this url to cite or link to this publication:

Chicago
Swiatczak, Tomasz, Bjorn Vermeersch, Gilbert De Mey, Boguslaw Wiecek, Jedrzej Banaszczyk, and Mariusz Felczak. 2010. “Evaluation of the Heat Transfer Coefficient in Microcircuits from the Frequency Analysis of the Thermal Transient Response.” Ieee Transactions on Components and Packaging Technologies 33 (2): 260–266.
APA
Swiatczak, T., Vermeersch, B., De Mey, G., Wiecek, B., Banaszczyk, J., & Felczak, M. (2010). Evaluation of the heat transfer coefficient in microcircuits from the frequency analysis of the thermal transient response. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 33(2), 260–266.
Vancouver
1.
Swiatczak T, Vermeersch B, De Mey G, Wiecek B, Banaszczyk J, Felczak M. Evaluation of the heat transfer coefficient in microcircuits from the frequency analysis of the thermal transient response. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. 2010;33(2):260–6.
MLA
Swiatczak, Tomasz et al. “Evaluation of the Heat Transfer Coefficient in Microcircuits from the Frequency Analysis of the Thermal Transient Response.” IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 33.2 (2010): 260–266. Print.
@article{5852060,
  abstract     = {In this paper, it is outlined how thermal AC measurements can be carried out on a resistor deposited on an electronic substrate. The AC approach enables us to limit ourselves to phase measurements which can be carried out with a much higher precision than amplitude measurements. It will also be demonstrated how the phase measurements at a well-chosen frequency can be used to measure the heat transfer coefficient.},
  author       = {Swiatczak, Tomasz and Vermeersch, Bjorn and De Mey, Gilbert and Wiecek, Boguslaw  and Banaszczyk, Jedrzej and Felczak, Mariusz},
  issn         = {1521-3331},
  journal      = {IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES},
  keywords     = {PULSED PHASE THERMOGRAPHY,LOCK-IN THERMOGRAPHY,MICROELECTRONIC STRUCTURES,NONDESTRUCTIVE EVALUATION,IMPEDANCE,DEVICES,METHODOLOGY,SIMULATION,PACKAGES,MODEL,AC thermal modeling,convective heat transfer,thermography measurements},
  language     = {eng},
  number       = {2},
  pages        = {260--266},
  title        = {Evaluation of the heat transfer coefficient in microcircuits from the frequency analysis of the thermal transient response},
  url          = {http://dx.doi.org/10.1109/TCAPT.2010.2046326},
  volume       = {33},
  year         = {2010},
}

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