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Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability

Michal Jablonski, Jan Vanfleteren UGent, Thomas Vervust UGent, Frederick Bossuyt, Riccardo Lucchini, Pasquale Vena, Hans De Vries and Mario Gonzalez (2015) MICROELECTRONICS RELIABILITY. 55(1). p.143-154
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
MAXIMUM-LIKELIHOOD-ESTIMATION, FEM, meandered interconnect, high conductivity, stretchable interconnect, SMI, Weibull analysis, SILICON ELECTRONICS, CARBON NANOTUBES, CONDUCTORS, CIRCUITS, DESIGN, SILVER, FILMS
journal title
MICROELECTRONICS RELIABILITY
j.microrel
volume
55
issue
1
pages
143 - 154
publisher
Elsevier
Web of Science type
Article
Web of Science id
000348957600020
JCR category
ENGINEERING, ELECTRICAL & ELECTRONIC
JCR impact factor
1.202 (2015)
JCR rank
133/255 (2015)
JCR quartile
3 (2015)
ISSN
0026-2714
DOI
10.1016/j.microrel.2014.09.009
project
PLACE-it
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
5819504
handle
http://hdl.handle.net/1854/LU-5819504
alternative location
http://www.sciencedirect.com/science/article/pii/S0026271414003898#
date created
2015-01-27 08:54:02
date last changed
2016-12-19 15:41:53
@article{5819504,
  author       = {Jablonski, Michal and Vanfleteren, Jan and Vervust, Thomas and Bossuyt, Frederick  and Lucchini, Riccardo and Vena, Pasquale and De Vries, Hans and Gonzalez, Mario},
  issn         = {0026-2714},
  journal      = {MICROELECTRONICS RELIABILITY},
  keyword      = {MAXIMUM-LIKELIHOOD-ESTIMATION,FEM,meandered interconnect,high conductivity,stretchable interconnect,SMI,Weibull analysis,SILICON ELECTRONICS,CARBON NANOTUBES,CONDUCTORS,CIRCUITS,DESIGN,SILVER,FILMS},
  language     = {eng},
  number       = {1},
  pages        = {143--154},
  publisher    = {Elsevier},
  title        = {Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability},
  url          = {http://dx.doi.org/10.1016/j.microrel.2014.09.009},
  volume       = {55},
  year         = {2015},
}

Chicago
Jablonski, Michal, Jan Vanfleteren, Thomas Vervust, Frederick Bossuyt, Riccardo Lucchini, Pasquale Vena, Hans De Vries, and Mario Gonzalez. 2015. “Impact of Geometry on Stretchable Meandered Interconnect Uniaxial Tensile Extension Fatigue Reliability.” Microelectronics Reliability 55 (1): 143–154.
APA
Jablonski, M., Vanfleteren, J., Vervust, T., Bossuyt, F., Lucchini, R., Vena, P., De Vries, H., et al. (2015). Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability. MICROELECTRONICS RELIABILITY, 55(1), 143–154.
Vancouver
1.
Jablonski M, Vanfleteren J, Vervust T, Bossuyt F, Lucchini R, Vena P, et al. Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability. MICROELECTRONICS RELIABILITY. Elsevier; 2015;55(1):143–54.
MLA
Jablonski, Michal, Jan Vanfleteren, Thomas Vervust, et al. “Impact of Geometry on Stretchable Meandered Interconnect Uniaxial Tensile Extension Fatigue Reliability.” MICROELECTRONICS RELIABILITY 55.1 (2015): 143–154. Print.