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Reduced 2nd level solder joint life time of low-CTE mold compound packages

Bart Vandevelde, Riet Labie, Geert Willems, Lieven Degrendele (UGent) , Maarten Cauwe (UGent) and Johan De Baets (UGent)
(2014) 5th Electronic Materials, Processes and Packaging for Space, Proceedings.
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Citation

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MLA
Vandevelde, Bart, et al. “Reduced 2nd Level Solder Joint Life Time of Low-CTE Mold Compound Packages.” 5th Electronic Materials, Processes and Packaging for Space, Proceedings, 2014.
APA
Vandevelde, B., Labie, R., Willems, G., Degrendele, L., Cauwe, M., & De Baets, J. (2014). Reduced 2nd level solder joint life time of low-CTE mold compound packages. 5th Electronic Materials, Processes and Packaging for Space, Proceedings. Presented at the 5th Electronic Materials, Processes and Packaging for Space (EMPPS - 2014) Workshop, Noordwijk, The Netherlands.
Chicago author-date
Vandevelde, Bart, Riet Labie, Geert Willems, Lieven Degrendele, Maarten Cauwe, and Johan De Baets. 2014. “Reduced 2nd Level Solder Joint Life Time of Low-CTE Mold Compound Packages.” In 5th Electronic Materials, Processes and Packaging for Space, Proceedings.
Chicago author-date (all authors)
Vandevelde, Bart, Riet Labie, Geert Willems, Lieven Degrendele, Maarten Cauwe, and Johan De Baets. 2014. “Reduced 2nd Level Solder Joint Life Time of Low-CTE Mold Compound Packages.” In 5th Electronic Materials, Processes and Packaging for Space, Proceedings.
Vancouver
1.
Vandevelde B, Labie R, Willems G, Degrendele L, Cauwe M, De Baets J. Reduced 2nd level solder joint life time of low-CTE mold compound packages. In: 5th Electronic Materials, Processes and Packaging for Space, Proceedings. 2014.
IEEE
[1]
B. Vandevelde, R. Labie, G. Willems, L. Degrendele, M. Cauwe, and J. De Baets, “Reduced 2nd level solder joint life time of low-CTE mold compound packages,” in 5th Electronic Materials, Processes and Packaging for Space, Proceedings, Noordwijk, The Netherlands, 2014.
@inproceedings{5773011,
  author       = {{Vandevelde, Bart and Labie, Riet and Willems, Geert and Degrendele, Lieven and Cauwe, Maarten and De Baets, Johan}},
  booktitle    = {{5th Electronic Materials, Processes and Packaging for Space, Proceedings}},
  language     = {{eng}},
  location     = {{Noordwijk, The Netherlands}},
  pages        = {{7}},
  title        = {{Reduced 2nd level solder joint life time of low-CTE mold compound packages}},
  year         = {{2014}},
}