Reduced 2nd level solder joint life time of low-CTE mold compound packages
- Author
- Bart Vandevelde, Riet Labie, Geert Willems, Lieven Degrendele (UGent) , Maarten Cauwe (UGent) and Johan De Baets (UGent)
- Organization
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-5773011
- MLA
- Vandevelde, Bart, et al. “Reduced 2nd Level Solder Joint Life Time of Low-CTE Mold Compound Packages.” 5th Electronic Materials, Processes and Packaging for Space, Proceedings, 2014.
- APA
- Vandevelde, B., Labie, R., Willems, G., Degrendele, L., Cauwe, M., & De Baets, J. (2014). Reduced 2nd level solder joint life time of low-CTE mold compound packages. 5th Electronic Materials, Processes and Packaging for Space, Proceedings. Presented at the 5th Electronic Materials, Processes and Packaging for Space (EMPPS - 2014) Workshop, Noordwijk, The Netherlands.
- Chicago author-date
- Vandevelde, Bart, Riet Labie, Geert Willems, Lieven Degrendele, Maarten Cauwe, and Johan De Baets. 2014. “Reduced 2nd Level Solder Joint Life Time of Low-CTE Mold Compound Packages.” In 5th Electronic Materials, Processes and Packaging for Space, Proceedings.
- Chicago author-date (all authors)
- Vandevelde, Bart, Riet Labie, Geert Willems, Lieven Degrendele, Maarten Cauwe, and Johan De Baets. 2014. “Reduced 2nd Level Solder Joint Life Time of Low-CTE Mold Compound Packages.” In 5th Electronic Materials, Processes and Packaging for Space, Proceedings.
- Vancouver
- 1.Vandevelde B, Labie R, Willems G, Degrendele L, Cauwe M, De Baets J. Reduced 2nd level solder joint life time of low-CTE mold compound packages. In: 5th Electronic Materials, Processes and Packaging for Space, Proceedings. 2014.
- IEEE
- [1]B. Vandevelde, R. Labie, G. Willems, L. Degrendele, M. Cauwe, and J. De Baets, “Reduced 2nd level solder joint life time of low-CTE mold compound packages,” in 5th Electronic Materials, Processes and Packaging for Space, Proceedings, Noordwijk, The Netherlands, 2014.
@inproceedings{5773011, author = {{Vandevelde, Bart and Labie, Riet and Willems, Geert and Degrendele, Lieven and Cauwe, Maarten and De Baets, Johan}}, booktitle = {{5th Electronic Materials, Processes and Packaging for Space, Proceedings}}, language = {{eng}}, location = {{Noordwijk, The Netherlands}}, pages = {{7}}, title = {{Reduced 2nd level solder joint life time of low-CTE mold compound packages}}, year = {{2014}}, }