Flexible and stretchable circuit technologies for space applications
- Author
- Maarten Cauwe (UGent) , Frederick Bossuyt (UGent) , Johan De Baets (UGent) and Jan Vanfleteren (UGent)
- Organization
- Abstract
- Flexible and stretchable circuit technologies offer reduced volume and weight, increased electrical performance, larger design freedom and improved interconnect reliability. All of these advantages are appealing for space applications. In this paper, two example technologies, the ultra-thin chip package (UTCP) and stretchable moulded interconnect (SMI), are described. The UTCP technology results in a 60 µm thick chip package, including the embedding of a 20 µm thick chip, laser or protolithic via definition to the chip contacts and application of fan out metallization. Imec’s stretchable interconnect technology is inspired by conventional rigid and flexible printed circuit board (PCB) technology. Stretchable interconnects are realized by copper meanders supported by a flexible material e.g. polyimide. Elastic materials, predominantly silicone rubbers, are used to embed the conductors and the components, thus serving as circuit carrier. The possible advantages of these technologies with respect to space applications are discussed.
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-5772933
- MLA
- Cauwe, Maarten, et al. “Flexible and Stretchable Circuit Technologies for Space Applications.” 5th Electronic Materials, Processes and Packaging for Space, Proceedings, 2014.
- APA
- Cauwe, M., Bossuyt, F., De Baets, J., & Vanfleteren, J. (2014). Flexible and stretchable circuit technologies for space applications. 5th Electronic Materials, Processes and Packaging for Space, Proceedings. Presented at the 5th Electronic Materials, Processes and Packaging for Space (EMPPS - 2014) Workshop, Noordwijk, The Netherlands.
- Chicago author-date
- Cauwe, Maarten, Frederick Bossuyt, Johan De Baets, and Jan Vanfleteren. 2014. “Flexible and Stretchable Circuit Technologies for Space Applications.” In 5th Electronic Materials, Processes and Packaging for Space, Proceedings.
- Chicago author-date (all authors)
- Cauwe, Maarten, Frederick Bossuyt, Johan De Baets, and Jan Vanfleteren. 2014. “Flexible and Stretchable Circuit Technologies for Space Applications.” In 5th Electronic Materials, Processes and Packaging for Space, Proceedings.
- Vancouver
- 1.Cauwe M, Bossuyt F, De Baets J, Vanfleteren J. Flexible and stretchable circuit technologies for space applications. In: 5th Electronic Materials, Processes and Packaging for Space, Proceedings. 2014.
- IEEE
- [1]M. Cauwe, F. Bossuyt, J. De Baets, and J. Vanfleteren, “Flexible and stretchable circuit technologies for space applications,” in 5th Electronic Materials, Processes and Packaging for Space, Proceedings, Noordwijk, The Netherlands, 2014.
@inproceedings{5772933, abstract = {{Flexible and stretchable circuit technologies offer reduced volume and weight, increased electrical performance, larger design freedom and improved interconnect reliability. All of these advantages are appealing for space applications. In this paper, two example technologies, the ultra-thin chip package (UTCP) and stretchable moulded interconnect (SMI), are described. The UTCP technology results in a 60 µm thick chip package, including the embedding of a 20 µm thick chip, laser or protolithic via definition to the chip contacts and application of fan out metallization. Imec’s stretchable interconnect technology is inspired by conventional rigid and flexible printed circuit board (PCB) technology. Stretchable interconnects are realized by copper meanders supported by a flexible material e.g. polyimide. Elastic materials, predominantly silicone rubbers, are used to embed the conductors and the components, thus serving as circuit carrier. The possible advantages of these technologies with respect to space applications are discussed.}}, author = {{Cauwe, Maarten and Bossuyt, Frederick and De Baets, Johan and Vanfleteren, Jan}}, booktitle = {{5th Electronic Materials, Processes and Packaging for Space, Proceedings}}, language = {{eng}}, location = {{Noordwijk, The Netherlands}}, pages = {{4}}, title = {{Flexible and stretchable circuit technologies for space applications}}, year = {{2014}}, }