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Chip-level interconnections realized via the laser-induced forward transfer technique

Kamalpreet Kaur (UGent) , Jeroen Missinne (UGent) and Geert Van Steenberge (UGent)
Author
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Abstract
In this paper, successful flip-chip bonding and DC characterization of single photodiode and VCSEL chips via Laser-Induced Forward Transfer (LIFT) printed micro-bumps of indium, silver nano-particle (AgNP) based inks and pastes, is reported.
Keywords
Flip-chip bonding, LIFT, VCSELs, Interconnects

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Citation

Please use this url to cite or link to this publication:

MLA
Kaur, Kamalpreet, Jeroen Missinne, and Geert Van Steenberge. “Chip-level Interconnections Realized via the Laser-induced Forward Transfer Technique.” Asia Communications and Photonics Conference, Proceedings. 2014. Print.
APA
Kaur, K., Missinne, J., & Van Steenberge, G. (2014). Chip-level interconnections realized via the laser-induced forward transfer technique. Asia Communications and Photonics Conference, Proceedings. Presented at the Asia Communications and Photonics Conference (ACP - 2014).
Chicago author-date
Kaur, Kamalpreet, Jeroen Missinne, and Geert Van Steenberge. 2014. “Chip-level Interconnections Realized via the Laser-induced Forward Transfer Technique.” In Asia Communications and Photonics Conference, Proceedings.
Chicago author-date (all authors)
Kaur, Kamalpreet, Jeroen Missinne, and Geert Van Steenberge. 2014. “Chip-level Interconnections Realized via the Laser-induced Forward Transfer Technique.” In Asia Communications and Photonics Conference, Proceedings.
Vancouver
1.
Kaur K, Missinne J, Van Steenberge G. Chip-level interconnections realized via the laser-induced forward transfer technique. Asia Communications and Photonics Conference, Proceedings. 2014.
IEEE
[1]
K. Kaur, J. Missinne, and G. Van Steenberge, “Chip-level interconnections realized via the laser-induced forward transfer technique,” in Asia Communications and Photonics Conference, Proceedings, Shanghai, China, 2014.
@inproceedings{5761024,
  abstract     = {In this paper, successful flip-chip bonding and DC characterization of single photodiode and VCSEL chips via Laser-Induced Forward Transfer (LIFT) printed micro-bumps of indium, silver nano-particle (AgNP) based inks and pastes, is reported.},
  author       = {Kaur, Kamalpreet and Missinne, Jeroen and Van Steenberge, Geert},
  booktitle    = {Asia Communications and Photonics Conference, Proceedings},
  keywords     = {Flip-chip bonding,LIFT,VCSELs,Interconnects},
  language     = {eng},
  location     = {Shanghai, China},
  pages        = {3},
  title        = {Chip-level interconnections realized via the laser-induced forward transfer technique},
  year         = {2014},
}