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Center for nano- and biophotonics (NB-Photonics)
Abstract
System performance scaling imposes an increase of package-to-package aggregate bandwidths to interface chips in high performance computing. This scaling is expected to encounter several I/O bottlenecks (pin count, speed, power consumption) when implemented in the electrical domain. Several optical interface technologies are being proposed among which silicon photonics, considered as a promising candidate. In this paper we will review the recent progress made in this technology that may enable multi-channel WDM links for package-to-package interconnects: 1.0V drivers with microring modulators and compact manufacturable microring filters with efficient thermal tuning.
Keywords
MODULATOR, Optical interconnects, photonics, silicon photonics, microring, WDM

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Citation

Please use this url to cite or link to this publication:

Chicago
Absil, Philippe P, Peter De Heyn, Pieter Dumon, Dries Van Thourhout, Peter Verheyen, shankar kumar Selvaraja, Guy Lepage, Marianna Pantouvaki, Michal Rakowski, and Joris Van Campenhout. 2014. “Advances in Silicon Photonics WDM Devices.” In Proceedings of the Society of Photo-optical Instrumentation Engineers (spie), ed. AK Srivastava Vol. 9010. SPIE.
APA
Absil, P. P., De Heyn, P., Dumon, P., Van Thourhout, D., Verheyen, P., Selvaraja, shankar kumar, Lepage, G., et al. (2014). Advances in silicon photonics WDM devices. In A. Srivastava (Ed.), PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE) (Vol. 9010). Presented at the Conference on Next-Generation Optical Networks for Data Centers and Short-Reach Links, SPIE.
Vancouver
1.
Absil PP, De Heyn P, Dumon P, Van Thourhout D, Verheyen P, Selvaraja shankar kumar, et al. Advances in silicon photonics WDM devices. In: Srivastava A, editor. PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). SPIE; 2014.
MLA
Absil, Philippe P, Peter De Heyn, Pieter Dumon, et al. “Advances in Silicon Photonics WDM Devices.” Proceedings of the Society of Photo-optical Instrumentation Engineers (spie). Ed. AK Srivastava . Vol. 9010. SPIE, 2014. Print.
@inproceedings{5756462,
  abstract     = {System performance scaling imposes an increase of package-to-package aggregate bandwidths to interface chips in high performance computing. This scaling is expected to encounter several I/O bottlenecks (pin count, speed, power consumption) when implemented in the electrical domain. Several optical interface technologies are being proposed among which silicon photonics, considered as a promising candidate. In this paper we will review the recent progress made in this technology that may enable multi-channel WDM links for package-to-package interconnects: 1.0V drivers with microring modulators and compact manufacturable microring filters with efficient thermal tuning.},
  articleno    = {90100J},
  author       = {Absil, Philippe P and De Heyn, Peter and Dumon, Pieter and Van Thourhout, Dries and Verheyen, Peter and Selvaraja, shankar kumar and Lepage, Guy and Pantouvaki, Marianna and Rakowski, Michal and Van Campenhout, Joris},
  booktitle    = {PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)},
  editor       = {Srivastava , AK },
  isbn         = {9780819499233},
  issn         = {0277-786X},
  language     = {eng},
  location     = {San Francisco, CA, USA},
  pages        = {7},
  publisher    = {SPIE},
  title        = {Advances in silicon photonics WDM devices},
  url          = {http://dx.doi.org/10.1117/12.2047350},
  volume       = {9010},
  year         = {2014},
}

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