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Measurements of millimeter wave test structures for high speed chip testing

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Abstract
This paper presents the frequency domain characterization of very high bandwidth connectorized traces and a millimeter wave rat race coupler. These connectorized differential grounded coplanar waveguide traces, essential for the testability of high speed integrated circuits, have a measured flat frequency response up to 67GHz which indicates correct connector footprint and transmission line design. The differential traces narrow down to a chip scale pitch of 150 μm allowing direct flip chip connections. This enabling the testing of millimeter wave integrated circuits without the need for probing. Furthermore, a 50GHz rat race coupler was fabricated to generate a differential clock from a single ended clock source.

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Citation

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MLA
De Keulenaer, Timothy et al. “Measurements of Millimeter Wave Test Structures for High Speed Chip Testing.” 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI). IEEE, 2014. 1–4. Print.
APA
De Keulenaer, T., Ban, Y., Torfs, G., Sercu, S., De Geest, J., & Bauwelinck, J. (2014). Measurements of millimeter wave test structures for high speed chip testing. 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI) (pp. 1–4). Presented at the 18th IEEE Workshop on Signal and Power Integrity (SPI), IEEE.
Chicago author-date
De Keulenaer, Timothy, Yu Ban, Guy Torfs, Stefaan Sercu, Jan De Geest, and Johan Bauwelinck. 2014. “Measurements of Millimeter Wave Test Structures for High Speed Chip Testing.” In 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI), 1–4. IEEE.
Chicago author-date (all authors)
De Keulenaer, Timothy, Yu Ban, Guy Torfs, Stefaan Sercu, Jan De Geest, and Johan Bauwelinck. 2014. “Measurements of Millimeter Wave Test Structures for High Speed Chip Testing.” In 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI), 1–4. IEEE.
Vancouver
1.
De Keulenaer T, Ban Y, Torfs G, Sercu S, De Geest J, Bauwelinck J. Measurements of millimeter wave test structures for high speed chip testing. 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI). IEEE; 2014. p. 1–4.
IEEE
[1]
T. De Keulenaer, Y. Ban, G. Torfs, S. Sercu, J. De Geest, and J. Bauwelinck, “Measurements of millimeter wave test structures for high speed chip testing,” in 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI), Gent, België, 2014, pp. 1–4.
@inproceedings{5744378,
  abstract     = {This paper presents the frequency domain characterization of very high bandwidth connectorized traces and a millimeter wave rat race coupler. These connectorized differential grounded coplanar waveguide traces, essential for the testability of high speed integrated circuits, have a measured flat frequency response up to 67GHz which indicates correct connector footprint and transmission line design. The differential traces narrow down to a chip scale pitch of 150 μm allowing direct flip chip connections. This enabling the testing of millimeter wave integrated circuits without the need for probing. Furthermore, a 50GHz rat race coupler was fabricated to generate a differential clock from a single ended clock source.},
  author       = {De Keulenaer, Timothy and Ban, Yu and Torfs, Guy and Sercu, Stefaan and De Geest, Jan and Bauwelinck, Johan},
  booktitle    = {2014 IEEE 18th Workshop on Signal and Power Integrity (SPI)},
  isbn         = {9781479935994},
  language     = {eng},
  location     = {Gent, België},
  pages        = {1--4},
  publisher    = {IEEE},
  title        = {Measurements of millimeter wave test structures for high speed chip testing},
  url          = {http://dx.doi.org/10.1109/SaPIW.2014.6844529},
  year         = {2014},
}

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