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Variability analysis of interconnect structures including general nonlinear elements in SPICE-type framework

(2014) ELECTRONICS LETTERS. 50(4). p.263-265
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Citation

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Chicago
Biondi, Alessandro, Paolo Manfredi, Dries Vande Ginste, Daniël De Zutter, and Flavio Canavero. 2014. “Variability Analysis of Interconnect Structures Including General Nonlinear Elements in SPICE-type Framework.” Electronics Letters 50 (4): 263–265.
APA
Biondi, Alessandro, Manfredi, P., Vande Ginste, D., De Zutter, D., & Canavero, F. (2014). Variability analysis of interconnect structures including general nonlinear elements in SPICE-type framework. ELECTRONICS LETTERS, 50(4), 263–265.
Vancouver
1.
Biondi A, Manfredi P, Vande Ginste D, De Zutter D, Canavero F. Variability analysis of interconnect structures including general nonlinear elements in SPICE-type framework. ELECTRONICS LETTERS. 2014;50(4):263–5.
MLA
Biondi, Alessandro, Paolo Manfredi, Dries Vande Ginste, et al. “Variability Analysis of Interconnect Structures Including General Nonlinear Elements in SPICE-type Framework.” ELECTRONICS LETTERS 50.4 (2014): 263–265. Print.
@article{5682784,
  author       = {Biondi, Alessandro and Manfredi, Paolo and Vande Ginste, Dries and De Zutter, Dani{\"e}l and Canavero, Flavio},
  issn         = {0013-5194},
  journal      = {ELECTRONICS LETTERS},
  language     = {eng},
  number       = {4},
  pages        = {263--265},
  title        = {Variability analysis of interconnect structures including general nonlinear elements in SPICE-type framework},
  volume       = {50},
  year         = {2014},
}

Web of Science
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