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The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating

(2014) ELECTROCHIMICA ACTA. 127. p.315-326
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Copper electrodeposition, Nucleation and growth, Direct plating, damascene process, Polyether suppressors, ELECTROCHEMICAL DEPOSITION, DIFFUSION BARRIER, CU INTERCONNECTS, GLYCOL, ELECTRODEPOSITION, CHLORIDE, METALLIZATION, INHIBITION, ADSORPTION, ADDITIVES

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Citation

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Chicago
Nagar, Magi Margalit, A Radisic, Katrien Strubbe, and PM Vereecken. 2014. “The Effect of Polyether Suppressors on the Nucleation and Growth of Copper on RuTa Seeded Substrate for Direct Copper Plating.” Electrochimica Acta 127: 315–326.
APA
Nagar, M. M., Radisic, A., Strubbe, K., & Vereecken, P. (2014). The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating. ELECTROCHIMICA ACTA, 127, 315–326.
Vancouver
1.
Nagar MM, Radisic A, Strubbe K, Vereecken P. The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating. ELECTROCHIMICA ACTA. 2014;127:315–26.
MLA
Nagar, Magi Margalit, A Radisic, Katrien Strubbe, et al. “The Effect of Polyether Suppressors on the Nucleation and Growth of Copper on RuTa Seeded Substrate for Direct Copper Plating.” ELECTROCHIMICA ACTA 127 (2014): 315–326. Print.
@article{5658859,
  author       = {Nagar, Magi Margalit and Radisic, A and Strubbe, Katrien and Vereecken, PM},
  issn         = {0013-4686},
  journal      = {ELECTROCHIMICA ACTA},
  language     = {eng},
  pages        = {315--326},
  title        = {The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating},
  url          = {http://dx.doi.org/10.1016/j.electacta.2014.025.052},
  volume       = {127},
  year         = {2014},
}

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