Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer
- Author
- Kamalpreet Kaur (UGent) , Jeroen Missinne (UGent) and Geert Van Steenberge (UGent)
- Organization
- Keywords
- Laser-induced forward transfer (LIFT), indium, VCSELs, flip-chip
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-4292645
- MLA
- Kaur, Kamalpreet, et al. “Flip-Chip Bonding of Vertical-Cavity Surface-Emitting Lasers Using Laser-Induced Forward Transfer.” APPLIED PHYSICS LETTERS, vol. 104, no. 6, 2014, doi:10.1063/1.4864406.
- APA
- Kaur, K., Missinne, J., & Van Steenberge, G. (2014). Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer. APPLIED PHYSICS LETTERS, 104(6). https://doi.org/10.1063/1.4864406
- Chicago author-date
- Kaur, Kamalpreet, Jeroen Missinne, and Geert Van Steenberge. 2014. “Flip-Chip Bonding of Vertical-Cavity Surface-Emitting Lasers Using Laser-Induced Forward Transfer.” APPLIED PHYSICS LETTERS 104 (6). https://doi.org/10.1063/1.4864406.
- Chicago author-date (all authors)
- Kaur, Kamalpreet, Jeroen Missinne, and Geert Van Steenberge. 2014. “Flip-Chip Bonding of Vertical-Cavity Surface-Emitting Lasers Using Laser-Induced Forward Transfer.” APPLIED PHYSICS LETTERS 104 (6). doi:10.1063/1.4864406.
- Vancouver
- 1.Kaur K, Missinne J, Van Steenberge G. Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer. APPLIED PHYSICS LETTERS. 2014;104(6).
- IEEE
- [1]K. Kaur, J. Missinne, and G. Van Steenberge, “Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer,” APPLIED PHYSICS LETTERS, vol. 104, no. 6, 2014.
@article{4292645,
articleno = {{061102}},
author = {{Kaur, Kamalpreet and Missinne, Jeroen and Van Steenberge, Geert}},
issn = {{0003-6951}},
journal = {{APPLIED PHYSICS LETTERS}},
keywords = {{Laser-induced forward transfer (LIFT),indium,VCSELs,flip-chip}},
language = {{eng}},
number = {{6}},
pages = {{3}},
title = {{Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer}},
url = {{http://doi.org/10.1063/1.4864406}},
volume = {{104}},
year = {{2014}},
}
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