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Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer

Kamalpreet Kaur (UGent) , Jeroen Missinne (UGent) and Geert Van Steenberge (UGent)
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Keywords
Laser-induced forward transfer (LIFT), indium, VCSELs, flip-chip

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Citation

Please use this url to cite or link to this publication:

Chicago
Kaur, Kamalpreet, Jeroen Missinne, and Geert Van Steenberge. 2014. “Flip-chip Bonding of Vertical-cavity Surface-emitting Lasers Using Laser-induced Forward Transfer.” Applied Physics Letters 104 (6).
APA
Kaur, Kamalpreet, Missinne, J., & Van Steenberge, G. (2014). Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer. APPLIED PHYSICS LETTERS, 104(6).
Vancouver
1.
Kaur K, Missinne J, Van Steenberge G. Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer. APPLIED PHYSICS LETTERS. 2014;104(6).
MLA
Kaur, Kamalpreet, Jeroen Missinne, and Geert Van Steenberge. “Flip-chip Bonding of Vertical-cavity Surface-emitting Lasers Using Laser-induced Forward Transfer.” APPLIED PHYSICS LETTERS 104.6 (2014): n. pag. Print.
@article{4292645,
  articleno    = {061102},
  author       = {Kaur, Kamalpreet and Missinne, Jeroen and Van Steenberge, Geert},
  issn         = {0003-6951},
  journal      = {APPLIED PHYSICS LETTERS},
  language     = {eng},
  number       = {6},
  pages        = {3},
  title        = {Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer},
  url          = {http://dx.doi.org/10.1063/1.4864406},
  volume       = {104},
  year         = {2014},
}

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