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Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer

Kamalpreet Kaur (UGent) , Jeroen Missinne (UGent) and Geert Van Steenberge (UGent)
Author
Organization
Keywords
Laser-induced forward transfer (LIFT), indium, VCSELs, flip-chip

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Citation

Please use this url to cite or link to this publication:

MLA
Kaur, Kamalpreet, et al. “Flip-Chip Bonding of Vertical-Cavity Surface-Emitting Lasers Using Laser-Induced Forward Transfer.” APPLIED PHYSICS LETTERS, vol. 104, no. 6, 2014, doi:10.1063/1.4864406.
APA
Kaur, K., Missinne, J., & Van Steenberge, G. (2014). Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer. APPLIED PHYSICS LETTERS, 104(6). https://doi.org/10.1063/1.4864406
Chicago author-date
Kaur, Kamalpreet, Jeroen Missinne, and Geert Van Steenberge. 2014. “Flip-Chip Bonding of Vertical-Cavity Surface-Emitting Lasers Using Laser-Induced Forward Transfer.” APPLIED PHYSICS LETTERS 104 (6). https://doi.org/10.1063/1.4864406.
Chicago author-date (all authors)
Kaur, Kamalpreet, Jeroen Missinne, and Geert Van Steenberge. 2014. “Flip-Chip Bonding of Vertical-Cavity Surface-Emitting Lasers Using Laser-Induced Forward Transfer.” APPLIED PHYSICS LETTERS 104 (6). doi:10.1063/1.4864406.
Vancouver
1.
Kaur K, Missinne J, Van Steenberge G. Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer. APPLIED PHYSICS LETTERS. 2014;104(6).
IEEE
[1]
K. Kaur, J. Missinne, and G. Van Steenberge, “Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer,” APPLIED PHYSICS LETTERS, vol. 104, no. 6, 2014.
@article{4292645,
  articleno    = {{061102}},
  author       = {{Kaur, Kamalpreet and Missinne, Jeroen and Van Steenberge, Geert}},
  issn         = {{0003-6951}},
  journal      = {{APPLIED PHYSICS LETTERS}},
  keywords     = {{Laser-induced forward transfer (LIFT),indium,VCSELs,flip-chip}},
  language     = {{eng}},
  number       = {{6}},
  pages        = {{3}},
  title        = {{Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer}},
  url          = {{http://dx.doi.org/10.1063/1.4864406}},
  volume       = {{104}},
  year         = {{2014}},
}

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