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Ultra-low copper baths for sub-35 nm copper interconnects

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POLYETHYLENE-GLYCOL, ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY, CU ELECTRODEPOSITION, SUPERCONFORMAL ELECTRODEPOSITION, ADSORPTION-DESORPTION, CHLORIDE-IONS, DEPOSITION, ADDITIVES, ACCELERATOR, SUPPRESSION

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Chicago
Atanasova, Tanya, L Carbonell, R Caluwaerts, Zs Tõkei, Katrien Strubbe, and PM Vereecken. 2013. “Ultra-low Copper Baths for Sub-35 Nm Copper Interconnects.” Journal of the Electrochemical Society 160 (12): 3255–3259.
APA
Atanasova, T., Carbonell, L., Caluwaerts, R., Tõkei, Z., Strubbe, K., & Vereecken, P. (2013). Ultra-low copper baths for sub-35 nm copper interconnects. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 160(12), 3255–3259.
Vancouver
1.
Atanasova T, Carbonell L, Caluwaerts R, Tõkei Z, Strubbe K, Vereecken P. Ultra-low copper baths for sub-35 nm copper interconnects. JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 2013;160(12):3255–9.
MLA
Atanasova, Tanya, L Carbonell, R Caluwaerts, et al. “Ultra-low Copper Baths for Sub-35 Nm Copper Interconnects.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY 160.12 (2013): 3255–3259. Print.
@article{4248100,
  author       = {Atanasova, Tanya and Carbonell, L and Caluwaerts, R and T{\~o}kei, Zs and Strubbe, Katrien and Vereecken, PM},
  issn         = {0013-4651},
  journal      = {JOURNAL OF THE ELECTROCHEMICAL SOCIETY},
  keyword      = {POLYETHYLENE-GLYCOL,ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY,CU ELECTRODEPOSITION,SUPERCONFORMAL ELECTRODEPOSITION,ADSORPTION-DESORPTION,CHLORIDE-IONS,DEPOSITION,ADDITIVES,ACCELERATOR,SUPPRESSION},
  language     = {eng},
  number       = {12},
  pages        = {3255--3259},
  title        = {Ultra-low copper baths for sub-35 nm copper interconnects},
  url          = {http://dx.doi.org/10.1149/2.041312jes},
  volume       = {160},
  year         = {2013},
}

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