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Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections

J VAN ERPS, Nina Hendrickx UGent, C DEBAES, Peter Van Daele UGent and Hugo Thienpont UGent (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). p.70-75
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC)
pages
70-75 pages
UGent publication?
yes
classification
C1
id
424483
handle
http://hdl.handle.net/1854/LU-424483
date created
2008-06-30 13:06:00
date last changed
2016-12-19 15:36:06
@inproceedings{424483,
  author       = {VAN ERPS, J and Hendrickx, Nina and DEBAES, C and Van Daele, Peter and Thienpont, Hugo},
  booktitle    = {Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC)},
  pages        = {70--75},
  title        = {Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections},
  year         = {2007},
}

Chicago
VAN ERPS, J, Nina Hendrickx, C DEBAES, Peter Van Daele, and Hugo Thienpont. 2007. “Prototyping of Pluggable Out-of-plane Coupling Components for Multilayer Board-level Optical Interconnections.” In Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), 70–75.
APA
VAN ERPS, J., Hendrickx, N., DEBAES, C., Van Daele, P., & Thienpont, H. (2007). Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections. Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC) (pp. 70–75).
Vancouver
1.
VAN ERPS J, Hendrickx N, DEBAES C, Van Daele P, Thienpont H. Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections. Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). 2007. p. 70–5.
MLA
VAN ERPS, J, Nina Hendrickx, C DEBAES, et al. “Prototyping of Pluggable Out-of-plane Coupling Components for Multilayer Board-level Optical Interconnections.” Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). 2007. 70–75. Print.