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Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections

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Chicago
VAN ERPS, J, Nina Hendrickx, C DEBAES, Peter Van Daele, and Hugo Thienpont. 2007. “Prototyping of Pluggable Out-of-plane Coupling Components for Multilayer Board-level Optical Interconnections.” In Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), 70–75.
APA
VAN ERPS, J., Hendrickx, N., DEBAES, C., Van Daele, P., & Thienpont, H. (2007). Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections. Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC) (pp. 70–75).
Vancouver
1.
VAN ERPS J, Hendrickx N, DEBAES C, Van Daele P, Thienpont H. Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections. Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). 2007. p. 70–5.
MLA
VAN ERPS, J, Nina Hendrickx, C DEBAES, et al. “Prototyping of Pluggable Out-of-plane Coupling Components for Multilayer Board-level Optical Interconnections.” Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). 2007. 70–75. Print.
@inproceedings{424483,
  author       = {VAN ERPS, J and Hendrickx, Nina and DEBAES, C and Van Daele, Peter and Thienpont, Hugo},
  booktitle    = {Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC)},
  pages        = {70--75},
  title        = {Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections},
  year         = {2007},
}