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Inter-plane coupling structures for pcb-integrated multilayer optical interconnections

Nina Hendrickx UGent, J VAN ERPS, Hugo Thienpont UGent and Peter Van Daele UGent (2007) Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). p.65-69
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author
organization
year
type
conference
publication status
published
subject
in
Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC)
pages
65-69 pages
UGent publication?
yes
classification
C1
id
424481
handle
http://hdl.handle.net/1854/LU-424481
date created
2008-06-30 13:04:00
date last changed
2016-12-19 15:35:36
@inproceedings{424481,
  author       = {Hendrickx, Nina and VAN ERPS, J and Thienpont, Hugo and Van Daele, Peter},
  booktitle    = {Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC)},
  pages        = {65--69},
  title        = {Inter-plane coupling structures for pcb-integrated multilayer optical interconnections},
  year         = {2007},
}

Chicago
Hendrickx, Nina, J VAN ERPS, Hugo Thienpont, and Peter Van Daele. 2007. “Inter-plane Coupling Structures for Pcb-integrated Multilayer Optical Interconnections.” In Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), 65–69.
APA
Hendrickx, Nina, VAN ERPS, J., Thienpont, H., & Van Daele, P. (2007). Inter-plane coupling structures for pcb-integrated multilayer optical interconnections. Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC) (pp. 65–69).
Vancouver
1.
Hendrickx N, VAN ERPS J, Thienpont H, Van Daele P. Inter-plane coupling structures for pcb-integrated multilayer optical interconnections. Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). 2007. p. 65–9.
MLA
Hendrickx, Nina, J VAN ERPS, Hugo Thienpont, et al. “Inter-plane Coupling Structures for Pcb-integrated Multilayer Optical Interconnections.” Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC). 2007. 65–69. Print.