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A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination

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Keywords
Hysteresis, Reactive sputtering, SILICON, Elevated pressure, Modeling, VOLTAGE

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MLA
Sarhammar, E., et al. “A Study of the Process Pressure Influence in Reactive Sputtering Aiming at Hysteresis Elimination.” SURFACE & COATINGS TECHNOLOGY, vol. 232, 2013, pp. 357–61, doi:10.1016/j.surfcoat.2013.05.035.
APA
Sarhammar, E., Strijckmans, K., Nyberg, T., Van Steenberge, S., Berg, S., & Depla, D. (2013). A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination. SURFACE & COATINGS TECHNOLOGY, 232, 357–361. https://doi.org/10.1016/j.surfcoat.2013.05.035
Chicago author-date
Sarhammar, E, Koen Strijckmans, T Nyberg, Sigelinde Van Steenberge, S Berg, and Diederik Depla. 2013. “A Study of the Process Pressure Influence in Reactive Sputtering Aiming at Hysteresis Elimination.” SURFACE & COATINGS TECHNOLOGY 232: 357–61. https://doi.org/10.1016/j.surfcoat.2013.05.035.
Chicago author-date (all authors)
Sarhammar, E, Koen Strijckmans, T Nyberg, Sigelinde Van Steenberge, S Berg, and Diederik Depla. 2013. “A Study of the Process Pressure Influence in Reactive Sputtering Aiming at Hysteresis Elimination.” SURFACE & COATINGS TECHNOLOGY 232: 357–361. doi:10.1016/j.surfcoat.2013.05.035.
Vancouver
1.
Sarhammar E, Strijckmans K, Nyberg T, Van Steenberge S, Berg S, Depla D. A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination. SURFACE & COATINGS TECHNOLOGY. 2013;232:357–61.
IEEE
[1]
E. Sarhammar, K. Strijckmans, T. Nyberg, S. Van Steenberge, S. Berg, and D. Depla, “A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination,” SURFACE & COATINGS TECHNOLOGY, vol. 232, pp. 357–361, 2013.
@article{4237125,
  author       = {{Sarhammar, E and Strijckmans, Koen and Nyberg, T and Van Steenberge, Sigelinde and Berg, S and Depla, Diederik}},
  issn         = {{0257-8972}},
  journal      = {{SURFACE & COATINGS TECHNOLOGY}},
  keywords     = {{Hysteresis,Reactive sputtering,SILICON,Elevated pressure,Modeling,VOLTAGE}},
  language     = {{eng}},
  pages        = {{357--361}},
  title        = {{A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination}},
  url          = {{http://doi.org/10.1016/j.surfcoat.2013.05.035}},
  volume       = {{232}},
  year         = {{2013}},
}

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