A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination
- Author
- E Sarhammar, Koen Strijckmans (UGent) , T Nyberg, Sigelinde Van Steenberge, S Berg and Diederik Depla (UGent)
- Organization
- Keywords
- Hysteresis, Reactive sputtering, SILICON, Elevated pressure, Modeling, VOLTAGE
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Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-4237125
- MLA
- Sarhammar, E., et al. “A Study of the Process Pressure Influence in Reactive Sputtering Aiming at Hysteresis Elimination.” SURFACE & COATINGS TECHNOLOGY, vol. 232, 2013, pp. 357–61, doi:10.1016/j.surfcoat.2013.05.035.
- APA
- Sarhammar, E., Strijckmans, K., Nyberg, T., Van Steenberge, S., Berg, S., & Depla, D. (2013). A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination. SURFACE & COATINGS TECHNOLOGY, 232, 357–361. https://doi.org/10.1016/j.surfcoat.2013.05.035
- Chicago author-date
- Sarhammar, E, Koen Strijckmans, T Nyberg, Sigelinde Van Steenberge, S Berg, and Diederik Depla. 2013. “A Study of the Process Pressure Influence in Reactive Sputtering Aiming at Hysteresis Elimination.” SURFACE & COATINGS TECHNOLOGY 232: 357–61. https://doi.org/10.1016/j.surfcoat.2013.05.035.
- Chicago author-date (all authors)
- Sarhammar, E, Koen Strijckmans, T Nyberg, Sigelinde Van Steenberge, S Berg, and Diederik Depla. 2013. “A Study of the Process Pressure Influence in Reactive Sputtering Aiming at Hysteresis Elimination.” SURFACE & COATINGS TECHNOLOGY 232: 357–361. doi:10.1016/j.surfcoat.2013.05.035.
- Vancouver
- 1.Sarhammar E, Strijckmans K, Nyberg T, Van Steenberge S, Berg S, Depla D. A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination. SURFACE & COATINGS TECHNOLOGY. 2013;232:357–61.
- IEEE
- [1]E. Sarhammar, K. Strijckmans, T. Nyberg, S. Van Steenberge, S. Berg, and D. Depla, “A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination,” SURFACE & COATINGS TECHNOLOGY, vol. 232, pp. 357–361, 2013.
@article{4237125, author = {{Sarhammar, E and Strijckmans, Koen and Nyberg, T and Van Steenberge, Sigelinde and Berg, S and Depla, Diederik}}, issn = {{0257-8972}}, journal = {{SURFACE & COATINGS TECHNOLOGY}}, keywords = {{Hysteresis,Reactive sputtering,SILICON,Elevated pressure,Modeling,VOLTAGE}}, language = {{eng}}, pages = {{357--361}}, title = {{A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination}}, url = {{http://doi.org/10.1016/j.surfcoat.2013.05.035}}, volume = {{232}}, year = {{2013}}, }
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