Assembly of optoelectronics for efficient chip-to-waveguide coupling
- Author
- Erwin Bosman (UGent) , Kamalpreet Kaur (UGent) , Jeroen Missinne (UGent) , Bram Van Hoe (UGent) and Geert Van Steenberge (UGent)
- Organization
- Abstract
- This paper presents two solutions to achieve efficient optical coupling between vertical cavity surface emitting lasers and planar optical waveguides, by minimizing the free space optical path length. One approach is based on embedding of optoelectronic chips in polymer layers, and the other approach on flip-chip assembly using micro-bumps. These micro-bumps arc defined by laser-induced-forward-transfer (LIFT), a technique in which the bumping material can be transfered from a donor carrier to the waveguiding substrate. In both cases, out-of-plane bending of the light is accomplished by using a 45 degrees micro-mirror interface.
- Keywords
- embedding, lift, VCSEL, flip-chip, optical coupling, assembly, packaging
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-4210202
- MLA
- Bosman, Erwin, et al. “Assembly of Optoelectronics for Efficient Chip-to-Waveguide Coupling.” PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), IEEE, 2013, pp. 625–29.
- APA
- Bosman, E., Kaur, K., Missinne, J., Van Hoe, B., & Van Steenberge, G. (2013). Assembly of optoelectronics for efficient chip-to-waveguide coupling. PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 625–629. IEEE.
- Chicago author-date
- Bosman, Erwin, Kamalpreet Kaur, Jeroen Missinne, Bram Van Hoe, and Geert Van Steenberge. 2013. “Assembly of Optoelectronics for Efficient Chip-to-Waveguide Coupling.” In PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 625–29. IEEE.
- Chicago author-date (all authors)
- Bosman, Erwin, Kamalpreet Kaur, Jeroen Missinne, Bram Van Hoe, and Geert Van Steenberge. 2013. “Assembly of Optoelectronics for Efficient Chip-to-Waveguide Coupling.” In PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 625–629. IEEE.
- Vancouver
- 1.Bosman E, Kaur K, Missinne J, Van Hoe B, Van Steenberge G. Assembly of optoelectronics for efficient chip-to-waveguide coupling. In: PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013). IEEE; 2013. p. 625–9.
- IEEE
- [1]E. Bosman, K. Kaur, J. Missinne, B. Van Hoe, and G. Van Steenberge, “Assembly of optoelectronics for efficient chip-to-waveguide coupling,” in PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), Singapore, Singapore, 2013, pp. 625–629.
@inproceedings{4210202, abstract = {{This paper presents two solutions to achieve efficient optical coupling between vertical cavity surface emitting lasers and planar optical waveguides, by minimizing the free space optical path length. One approach is based on embedding of optoelectronic chips in polymer layers, and the other approach on flip-chip assembly using micro-bumps. These micro-bumps arc defined by laser-induced-forward-transfer (LIFT), a technique in which the bumping material can be transfered from a donor carrier to the waveguiding substrate. In both cases, out-of-plane bending of the light is accomplished by using a 45 degrees micro-mirror interface.}}, author = {{Bosman, Erwin and Kaur, Kamalpreet and Missinne, Jeroen and Van Hoe, Bram and Van Steenberge, Geert}}, booktitle = {{PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013)}}, isbn = {{9781479928323}}, keywords = {{embedding,lift,VCSEL,flip-chip,optical coupling,assembly,packaging}}, language = {{eng}}, location = {{Singapore, Singapore}}, pages = {{625--629}}, publisher = {{IEEE}}, title = {{Assembly of optoelectronics for efficient chip-to-waveguide coupling}}, year = {{2013}}, }