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Assembly of optoelectronics for efficient chip-to-waveguide coupling

Erwin Bosman (UGent) , Kamalpreet Kaur (UGent) , Jeroen Missinne (UGent) , Bram Van Hoe (UGent) and Geert Van Steenberge (UGent)
Author
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Keywords
embedding, lift, VCSEL, flip-chip, optical coupling, assembly, packaging

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Citation

Please use this url to cite or link to this publication:

MLA
Bosman, Erwin et al. “Assembly of Optoelectronics for Efficient Chip-to-waveguide Coupling.” 15th Electronics Packaging Technology Conference, Proceedings. IEEE, 2013. 630–634. Print.
APA
Bosman, E., Kaur, K., Missinne, J., Van Hoe, B., & Van Steenberge, G. (2013). Assembly of optoelectronics for efficient chip-to-waveguide coupling. 15th Electronics Packaging Technology Conference, Proceedings (pp. 630–634). Presented at the 15th Electronics Packaging Technology Conference (EPTC - 2013), IEEE.
Chicago author-date
Bosman, Erwin, Kamalpreet Kaur, Jeroen Missinne, Bram Van Hoe, and Geert Van Steenberge. 2013. “Assembly of Optoelectronics for Efficient Chip-to-waveguide Coupling.” In 15th Electronics Packaging Technology Conference, Proceedings, 630–634. IEEE.
Chicago author-date (all authors)
Bosman, Erwin, Kamalpreet Kaur, Jeroen Missinne, Bram Van Hoe, and Geert Van Steenberge. 2013. “Assembly of Optoelectronics for Efficient Chip-to-waveguide Coupling.” In 15th Electronics Packaging Technology Conference, Proceedings, 630–634. IEEE.
Vancouver
1.
Bosman E, Kaur K, Missinne J, Van Hoe B, Van Steenberge G. Assembly of optoelectronics for efficient chip-to-waveguide coupling. 15th Electronics Packaging Technology Conference, Proceedings. IEEE; 2013. p. 630–4.
IEEE
[1]
E. Bosman, K. Kaur, J. Missinne, B. Van Hoe, and G. Van Steenberge, “Assembly of optoelectronics for efficient chip-to-waveguide coupling,” in 15th Electronics Packaging Technology Conference, Proceedings, Singapore, Singapore, 2013, pp. 630–634.
@inproceedings{4210202,
  author       = {Bosman, Erwin and Kaur, Kamalpreet and Missinne, Jeroen and Van Hoe, Bram and Van Steenberge, Geert},
  booktitle    = {15th Electronics Packaging Technology Conference, Proceedings},
  isbn         = {9781479928323},
  keywords     = {embedding,lift,VCSEL,flip-chip,optical coupling,assembly,packaging},
  language     = {eng},
  location     = {Singapore, Singapore},
  pages        = {630--634},
  publisher    = {IEEE},
  title        = {Assembly of optoelectronics for efficient chip-to-waveguide coupling},
  year         = {2013},
}