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Assembly of optoelectronics for efficient chip-to-waveguide coupling

Erwin Bosman (UGent) , Kamalpreet Kaur (UGent) , Jeroen Missinne (UGent) , Bram Van Hoe (UGent) and Geert Van Steenberge (UGent)
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Keywords
embedding, lift, VCSEL, flip-chip, optical coupling, assembly, packaging

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Chicago
Bosman, Erwin, Kamalpreet Kaur, Jeroen Missinne, Bram Van Hoe, and Geert Van Steenberge. 2013. “Assembly of Optoelectronics for Efficient Chip-to-waveguide Coupling.” In 15th Electronics Packaging Technology Conference, Proceedings, 630–634. IEEE.
APA
Bosman, E., Kaur, K., Missinne, J., Van Hoe, B., & Van Steenberge, G. (2013). Assembly of optoelectronics for efficient chip-to-waveguide coupling. 15th Electronics Packaging Technology Conference, Proceedings (pp. 630–634). Presented at the 15th Electronics Packaging Technology Conference (EPTC - 2013), IEEE.
Vancouver
1.
Bosman E, Kaur K, Missinne J, Van Hoe B, Van Steenberge G. Assembly of optoelectronics for efficient chip-to-waveguide coupling. 15th Electronics Packaging Technology Conference, Proceedings. IEEE; 2013. p. 630–4.
MLA
Bosman, Erwin, Kamalpreet Kaur, Jeroen Missinne, et al. “Assembly of Optoelectronics for Efficient Chip-to-waveguide Coupling.” 15th Electronics Packaging Technology Conference, Proceedings. IEEE, 2013. 630–634. Print.
@inproceedings{4210202,
  author       = {Bosman, Erwin and Kaur, Kamalpreet and Missinne, Jeroen and Van Hoe, Bram and Van Steenberge, Geert},
  booktitle    = {15th Electronics Packaging Technology Conference, Proceedings},
  isbn         = {9781479928323},
  language     = {eng},
  location     = {Singapore, Singapore},
  pages        = {630--634},
  publisher    = {IEEE},
  title        = {Assembly of optoelectronics for efficient chip-to-waveguide coupling},
  year         = {2013},
}