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Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance

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Chicago
Kawka, Piotr, Gilbert De Mey, and Bjorn Vermeersch. 2007. “Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance.” Ieee Transactions on Components and Packaging Technologies 30 (4): 660–665.
APA
Kawka, P., De Mey, G., & Vermeersch, B. (2007). Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 30(4), 660–665.
Vancouver
1.
Kawka P, De Mey G, Vermeersch B. Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. 2007;30(4):660–5.
MLA
Kawka, Piotr, Gilbert De Mey, and Bjorn Vermeersch. “Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance.” IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 30.4 (2007): 660–665. Print.
@article{419623,
  author       = {Kawka, Piotr and De Mey, Gilbert and Vermeersch, Bjorn},
  issn         = {1521-3331},
  journal      = {IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES},
  language     = {eng},
  number       = {4},
  pages        = {660--665},
  title        = {Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance},
  volume       = {30},
  year         = {2007},
}

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