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Parylene C for hermetic and flexible encapsulation of interconnects and electronic components

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Abstract
Flexible electronics are of a great interest for wearable and implantable medical devices due to their conformality with the body, compared to electronics made on rigid carriers. Packaging of such electronics needs to offer sufficient flexibility and in addition, has to provide good protection for the electronics inside, also in humid and harsh environments, to prevent device failure due to corrosion. Parylene C is a popular polymer due to its interesting diffusion barrier properties. Parylene C coatings are also extremely conformal, hence it offers the possibility to be used as flexibleprotecting encapsulation for electronic components and interconnects. In order to provide sufficient mechanical support for the electronic circuit, a second encapsulation in PDMS will be performed. In our work, we study the barrier properties of Parylene for long time exposure to moisture and biofluids. Since adhesion is a very important parameter to prevent corrosion, this property is studied in detail. Various substrates and various adhesion promotion treatments are evaluated. Furthermore, copper interconnects coated with parylene C are immersed in biofluids at 37 C to study corrosion. Accelerated testing is also performed at 70 C to mimic long time exposure in a harsh, humid environment. Since the Parylene barrier layers are typically 5-15 micron thick, they are highly flexible, and hence they are interesting barriers to be used in flexible/stretchable electronics. Therefore, special attention is given to the evaluation of barrier properties when Parylene is bended and stretched.
Keywords
flexibility, corrosion tests., hermeticity, parylene C

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Citation

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MLA
Jarboui, Ahmed et al. “Parylene C for Hermetic and Flexible Encapsulation of Interconnects and Electronic Components.” 4th Flexible and Stretchable Electronics Conference 2013, Abstracts. 2013. Print.
APA
Jarboui, A., Cauwe, M., Vermeiren, F., Verplancke, R., Khemakhem, H., Vanfleteren, J., & Op de Beeck, M. (2013). Parylene C for hermetic and flexible encapsulation of interconnects and electronic components. 4th Flexible and Stretchable Electronics conference 2013, Abstracts. Presented at the 4th Flexible and Stretchable Electronics conference 2013.
Chicago author-date
Jarboui, Ahmed, Maarten Cauwe, Filip Vermeiren, Rik Verplancke, Hamadi Khemakhem, Jan Vanfleteren, and Maaike Op de Beeck. 2013. “Parylene C for Hermetic and Flexible Encapsulation of Interconnects and Electronic Components.” In 4th Flexible and Stretchable Electronics Conference 2013, Abstracts.
Chicago author-date (all authors)
Jarboui, Ahmed, Maarten Cauwe, Filip Vermeiren, Rik Verplancke, Hamadi Khemakhem, Jan Vanfleteren, and Maaike Op de Beeck. 2013. “Parylene C for Hermetic and Flexible Encapsulation of Interconnects and Electronic Components.” In 4th Flexible and Stretchable Electronics Conference 2013, Abstracts.
Vancouver
1.
Jarboui A, Cauwe M, Vermeiren F, Verplancke R, Khemakhem H, Vanfleteren J, et al. Parylene C for hermetic and flexible encapsulation of interconnects and electronic components. 4th Flexible and Stretchable Electronics conference 2013, Abstracts. 2013.
IEEE
[1]
A. Jarboui et al., “Parylene C for hermetic and flexible encapsulation of interconnects and electronic components,” in 4th Flexible and Stretchable Electronics conference 2013, Abstracts, Eindhoven, Netherlands, 2013.
@inproceedings{4187792,
  abstract     = {Flexible electronics are of a great interest for wearable and implantable medical devices due to their conformality with the body, compared to electronics made on rigid carriers. Packaging of such electronics needs to offer sufficient flexibility and in addition, has to provide good protection for the electronics inside, also in humid and harsh environments, to prevent device failure due to corrosion. Parylene C is a popular polymer due to its interesting diffusion barrier properties. Parylene C coatings are also extremely conformal, hence it offers the possibility to be used as flexibleprotecting encapsulation for electronic components and  interconnects. In order to provide sufficient mechanical support for the electronic circuit, a second encapsulation in PDMS will be performed. In our work, we study the barrier properties of Parylene for long time exposure to moisture and biofluids. Since adhesion is a very important parameter to prevent corrosion, this property is studied in detail. Various substrates and various adhesion promotion treatments are evaluated. Furthermore, copper interconnects coated with parylene C are immersed in biofluids at 37 C to study corrosion. Accelerated testing is also performed at 70 C to mimic long time exposure in a harsh, humid environment. Since the Parylene barrier layers are typically 5-15 micron thick, they are highly flexible, and hence they are interesting barriers to be used in flexible/stretchable electronics. Therefore, special attention is given to the evaluation of barrier properties when Parylene is bended and stretched.},
  author       = {Jarboui, Ahmed and Cauwe, Maarten and Vermeiren, Filip and Verplancke, Rik and Khemakhem, Hamadi and Vanfleteren, Jan and Op de Beeck, Maaike},
  booktitle    = {4th Flexible and Stretchable Electronics conference 2013, Abstracts},
  keywords     = {flexibility,corrosion tests.,hermeticity,parylene C},
  language     = {eng},
  location     = {Eindhoven, Netherlands},
  title        = {Parylene C for hermetic and flexible encapsulation of interconnects and electronic components},
  year         = {2013},
}