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Tolerance analysis for multilayer optical interconnections integrated on a printed circuit board

(2007) JOURNAL OF LIGHTWAVE TECHNOLOGY. 25(9). p.2395-2401
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Chicago
Hendrickx, Nina, J VAN ERPS, Geert Van Steenberge, Hugo Thienpont, and Peter Van Daele. 2007. “Tolerance Analysis for Multilayer Optical Interconnections Integrated on a Printed Circuit Board.” Journal of Lightwave Technology 25 (9): 2395–2401.
APA
Hendrickx, Nina, VAN ERPS, J., Van Steenberge, G., Thienpont, H., & Van Daele, P. (2007). Tolerance analysis for multilayer optical interconnections integrated on a printed circuit board. JOURNAL OF LIGHTWAVE TECHNOLOGY, 25(9), 2395–2401.
Vancouver
1.
Hendrickx N, VAN ERPS J, Van Steenberge G, Thienpont H, Van Daele P. Tolerance analysis for multilayer optical interconnections integrated on a printed circuit board. JOURNAL OF LIGHTWAVE TECHNOLOGY. 2007;25(9):2395–401.
MLA
Hendrickx, Nina, J VAN ERPS, Geert Van Steenberge, et al. “Tolerance Analysis for Multilayer Optical Interconnections Integrated on a Printed Circuit Board.” JOURNAL OF LIGHTWAVE TECHNOLOGY 25.9 (2007): 2395–2401. Print.
@article{415392,
  author       = {Hendrickx, Nina and VAN ERPS, J and Van Steenberge, Geert and Thienpont, Hugo and Van Daele, Peter},
  issn         = {0733-8724},
  journal      = {JOURNAL OF LIGHTWAVE TECHNOLOGY},
  language     = {eng},
  number       = {9},
  pages        = {2395--2401},
  title        = {Tolerance analysis for multilayer optical interconnections integrated on a printed circuit board},
  url          = {http://dx.doi.org/1854/10921},
  volume       = {25},
  year         = {2007},
}

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