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Abstract
Recent progress on novel photonics packaging concepts will be discussed, allowing for a dense integration of optical waveguides, coupling structures, light sources, detectors, and electronic circuitry. Through the involvement in various European research projects, these concepts are developed in different application domains, including printed circuit board-level optical interconnects (EU-FP7 project FIREFLY), active optical cable assemblies (EU-FP7 project MIRAGE), and artificial optical skin (EU-FP7 project PHOSFOS).
Keywords
waveguide, packaging, optoelectronics, photonics

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Chicago
Van Steenberge, Geert, Erwin Bosman, Jeroen Missinne, Bram Van Hoe, Kamalpreet Kaur, Sandeep Kalathimekkad, Nuria Teigell Beneitez, and Ahmed Elmogi. 2013. “Optoelectronics Packaging for Efficient Chip-to-waveguide Coupling.” In European Conference and Exhibition on Optical Communication : European Cluster in Optical Interconnects Workshop, Abstracts.
APA
Van Steenberge, G., Bosman, E., Missinne, J., Van Hoe, B., Kaur, K., Kalathimekkad, S., Teigell Beneitez, N., et al. (2013). Optoelectronics packaging for efficient chip-to-waveguide coupling. European Conference and Exhibition on Optical Communication : European Cluster in Optical Interconnects Workshop, Abstracts. Presented at the European Conference and Exhibition on Optical Communication : European Cluster in Optical Interconnects Workshop.
Vancouver
1.
Van Steenberge G, Bosman E, Missinne J, Van Hoe B, Kaur K, Kalathimekkad S, et al. Optoelectronics packaging for efficient chip-to-waveguide coupling. European Conference and Exhibition on Optical Communication : European Cluster in Optical Interconnects Workshop, Abstracts. 2013.
MLA
Van Steenberge, Geert, Erwin Bosman, Jeroen Missinne, et al. “Optoelectronics Packaging for Efficient Chip-to-waveguide Coupling.” European Conference and Exhibition on Optical Communication : European Cluster in Optical Interconnects Workshop, Abstracts. 2013. Print.
@inproceedings{4147643,
  abstract     = {Recent progress on novel photonics packaging concepts will be discussed, allowing for a dense integration of optical waveguides, coupling structures, light sources, detectors, and electronic circuitry. Through the involvement in various European research projects, these concepts are developed in different application domains, including printed circuit board-level optical interconnects (EU-FP7 project FIREFLY), active optical cable assemblies (EU-FP7 project MIRAGE), and artificial optical skin (EU-FP7 project PHOSFOS).},
  author       = {Van Steenberge, Geert and Bosman, Erwin and Missinne, Jeroen and Van Hoe, Bram and Kaur, Kamalpreet and Kalathimekkad, Sandeep and Teigell Beneitez, Nuria and Elmogi, Ahmed},
  booktitle    = {European Conference and Exhibition on Optical Communication : European Cluster in Optical Interconnects Workshop, Abstracts},
  language     = {eng},
  location     = {London, UK},
  title        = {Optoelectronics packaging for efficient chip-to-waveguide coupling},
  year         = {2013},
}