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Low-cost MOEM interconnect modules for Tb/s.cm(2) aggregate bandwidth to Silicon chips

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Chicago
Thienpont, Hugo, V BAUKENS, B VOLCKAERTS, Heidi Ottevaere, C DEBAES, M VERVAEKE, Pascal Tuteleers, et al. 2001. “Low-cost MOEM Interconnect Modules for Tb/s.cm(2) Aggregate Bandwidth to Silicon Chips.” DESIGN,TEST INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001 4408: 6–18.
APA
Thienpont, Hugo, BAUKENS, V., VOLCKAERTS, B., Ottevaere, H., DEBAES, C., VERVAEKE, M., Tuteleers, P., et al. (2001). Low-cost MOEM interconnect modules for Tb/s.cm(2) aggregate bandwidth to Silicon chips. DESIGN,TEST INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001, 4408, 6–18.
Vancouver
1.
Thienpont H, BAUKENS V, VOLCKAERTS B, Ottevaere H, DEBAES C, VERVAEKE M, et al. Low-cost MOEM interconnect modules for Tb/s.cm(2) aggregate bandwidth to Silicon chips. DESIGN,TEST INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001. 2001;4408:6–18.
MLA
Thienpont, Hugo, V BAUKENS, B VOLCKAERTS, et al. “Low-cost MOEM Interconnect Modules for Tb/s.cm(2) Aggregate Bandwidth to Silicon Chips.” DESIGN,TEST INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001 4408 (2001): 6–18. Print.
@article{412363,
  author       = {Thienpont, Hugo and BAUKENS, V and VOLCKAERTS, B and Ottevaere, Heidi and DEBAES, C and VERVAEKE, M and Tuteleers, Pascal and VYNCK, P and HERMANNE, A and HANNEY, M and Brunfaut, Marnik and Van Campenhout, Jan and Veretennicoff, Irina},
  issn         = {0277-786X},
  journal      = {DESIGN,TEST INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001},
  language     = {eng},
  pages        = {6--18},
  title        = {Low-cost MOEM interconnect modules for Tb/s.cm(2) aggregate bandwidth to Silicon chips},
  volume       = {4408},
  year         = {2001},
}

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