Photonic interconnects to silicon chips
(2004)
PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE).
5359.
p.337-351
- Author
- C Debaes, M Vervaeke, V Baukens, Heidi Ottevaere (UGent) , P Vynck, Pascal Tuteleers, B Volckaerts, Wim Meeus (UGent) , Marnik Brunfaut, Jan Van Campenhout (UGent) , A Hermanne and Hugo Thienpont (UGent)
- Organization
- Abstract
- A multi-channel free-space micro-optical module for dense MCM-level optical interconnections has been designed and fabricated. Extensive modeling proves that the module is scalable with a potential for multi-Tb/s.cm2 aggregate bit rate capacity while alignment and fabrication tolerances are compatible with present-day mass replication techniques. The micro-optical module is an assembly of refractive lenslet-arrays and a high-quality micro-prism. Both components are prototyped using deep lithography with protons and are monolithically integrated using vacuum casting replication technique. The resulting 16-channel high optical-grade plastic module shows optical transfer efficiencies of 46% and inter-channel cross talks as low as -22 dB, sufficient to establish workable multi-channel MCM-level interconnections. This micro-optical module was used in a feasibility demonstrator to establish intra-chip optical interconnections on a 0.6gm CMOS opto-electronic field programmable gate array. This opto-electronic chip combines fully functional digital logic, driver and receiver circuitry and flip-chipped VCSEL and detector arrays. With this test-vehicle multichannel on-chip data-communication has been achieved for the first time to our knowledge. The bit rate per channel was limited to 10Mb/s because of the limited speed of the chip tester.
- Keywords
- VCSELS, OE-VLSI, micro-optics, optical interconnections, deep proton lithography, SPEED, SYSTEM, CIRCUITS, PROTOTYPE, COMPONENTS, MODULES, OPTICAL INTERCONNECTS
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-411947
- MLA
- Debaes, C., et al. “Photonic Interconnects to Silicon Chips.” PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), edited by M Razeghi and GJ Brown, vol. 5359, SPIE : The International Society for Optical Engineering, 2004, pp. 337–51, doi:10.1117/12.518315.
- APA
- Debaes, C., Vervaeke, M., Baukens, V., Ottevaere, H., Vynck, P., Tuteleers, P., … Thienpont, H. (2004). Photonic interconnects to silicon chips. In M. Razeghi & G. Brown (Eds.), PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE) (Vol. 5359, pp. 337–351). https://doi.org/10.1117/12.518315
- Chicago author-date
- Debaes, C, M Vervaeke, V Baukens, Heidi Ottevaere, P Vynck, Pascal Tuteleers, B Volckaerts, et al. 2004. “Photonic Interconnects to Silicon Chips.” In PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), edited by M Razeghi and GJ Brown, 5359:337–51. Bellingham, WA, USA: SPIE : The International Society for Optical Engineering. https://doi.org/10.1117/12.518315.
- Chicago author-date (all authors)
- Debaes, C, M Vervaeke, V Baukens, Heidi Ottevaere, P Vynck, Pascal Tuteleers, B Volckaerts, Wim Meeus, Marnik Brunfaut, Jan Van Campenhout, A Hermanne, and Hugo Thienpont. 2004. “Photonic Interconnects to Silicon Chips.” In PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), ed by. M Razeghi and GJ Brown, 5359:337–351. Bellingham, WA, USA: SPIE : The International Society for Optical Engineering. doi:10.1117/12.518315.
- Vancouver
- 1.Debaes C, Vervaeke M, Baukens V, Ottevaere H, Vynck P, Tuteleers P, et al. Photonic interconnects to silicon chips. In: Razeghi M, Brown G, editors. PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). Bellingham, WA, USA: SPIE : The International Society for Optical Engineering; 2004. p. 337–51.
- IEEE
- [1]C. Debaes et al., “Photonic interconnects to silicon chips,” in PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), San Jose, CA, USA, 2004, vol. 5359, pp. 337–351.
@inproceedings{411947, abstract = {{A multi-channel free-space micro-optical module for dense MCM-level optical interconnections has been designed and fabricated. Extensive modeling proves that the module is scalable with a potential for multi-Tb/s.cm2 aggregate bit rate capacity while alignment and fabrication tolerances are compatible with present-day mass replication techniques. The micro-optical module is an assembly of refractive lenslet-arrays and a high-quality micro-prism. Both components are prototyped using deep lithography with protons and are monolithically integrated using vacuum casting replication technique. The resulting 16-channel high optical-grade plastic module shows optical transfer efficiencies of 46% and inter-channel cross talks as low as -22 dB, sufficient to establish workable multi-channel MCM-level interconnections. This micro-optical module was used in a feasibility demonstrator to establish intra-chip optical interconnections on a 0.6gm CMOS opto-electronic field programmable gate array. This opto-electronic chip combines fully functional digital logic, driver and receiver circuitry and flip-chipped VCSEL and detector arrays. With this test-vehicle multichannel on-chip data-communication has been achieved for the first time to our knowledge. The bit rate per channel was limited to 10Mb/s because of the limited speed of the chip tester.}}, author = {{Debaes, C and Vervaeke, M and Baukens, V and Ottevaere, Heidi and Vynck, P and Tuteleers, Pascal and Volckaerts, B and Meeus, Wim and Brunfaut, Marnik and Van Campenhout, Jan and Hermanne, A and Thienpont, Hugo}}, booktitle = {{PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)}}, editor = {{Razeghi, M and Brown, GJ}}, issn = {{0277-786X}}, keywords = {{VCSELS,OE-VLSI,micro-optics,optical interconnections,deep proton lithography,SPEED,SYSTEM,CIRCUITS,PROTOTYPE,COMPONENTS,MODULES,OPTICAL INTERCONNECTS}}, language = {{eng}}, location = {{San Jose, CA, USA}}, pages = {{337--351}}, publisher = {{SPIE : The International Society for Optical Engineering}}, title = {{Photonic interconnects to silicon chips}}, url = {{http://doi.org/10.1117/12.518315}}, volume = {{5359}}, year = {{2004}}, }
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