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Sealed ultra low-k organosilica films with improved electrical, mechanical and chemical properties

Frederik Goethals, Elisabeth Levrau UGent, Glenn Pollefeyt, Mikhail R Baklanov, Ivan Ciofi, Kris Vanstreels, Christophe Detavernier UGent, Isabel Van Driessche UGent and Pascal Van Der Voort UGent (2013) JOURNAL OF MATERIALS CHEMISTRY C. 1(25). p.3961-3966
abstract
In this contribution, we present sealed ultra low-k organosilica films that have improved electrical, mechanical and chemical properties. The films consist of a mesoporous ethylene-bridged organosilica layer at the bottom and an almost non-porous cyclic carbon-bridged top layer. This top layer effectively seals metal penetration during atomic layer deposition processes. Furthermore, by applying this sealing approach we can lower the dielectric constant of the pristine mesoporous film from 2.5 to 2.07 while we can also lower the leakage current and improve the mechanical and chemical stability.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
ATOMIC LAYER DEPOSITION, DIELECTRIC-CONSTANT MATERIALS, ELLIPSOMETRIC POROSIMETRY, BARRIER LAYER, SILICA, INTERCONNECTS, INTEGRATION, CHALLENGES, RESISTANCE, IMPACT
journal title
JOURNAL OF MATERIALS CHEMISTRY C
J. Mater. Chem. C
volume
1
issue
25
pages
3961 - 3966
Web of Science type
Article
Web of Science id
000319988200010
JCR category
MATERIALS SCIENCE, MULTIDISCIPLINARY
JCR rank
249/251 (2013)
JCR quartile
4 (2013)
ISSN
2050-7526
DOI
10.1039/c3tc30522h
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
4099642
handle
http://hdl.handle.net/1854/LU-4099642
date created
2013-07-11 11:59:04
date last changed
2016-12-19 15:45:08
@article{4099642,
  abstract     = {In this contribution, we present sealed ultra low-k organosilica films that have improved electrical, mechanical and chemical properties. The films consist of a mesoporous ethylene-bridged organosilica layer at the bottom and an almost non-porous cyclic carbon-bridged top layer. This top layer effectively seals metal penetration during atomic layer deposition processes. Furthermore, by applying this sealing approach we can lower the dielectric constant of the pristine mesoporous film from 2.5 to 2.07 while we can also lower the leakage current and improve the mechanical and chemical stability.},
  author       = {Goethals, Frederik and Levrau, Elisabeth and Pollefeyt, Glenn and Baklanov, Mikhail R and Ciofi, Ivan and Vanstreels, Kris and Detavernier, Christophe and Van Driessche, Isabel and Van Der Voort, Pascal},
  issn         = {2050-7526},
  journal      = {JOURNAL OF MATERIALS CHEMISTRY C},
  keyword      = {ATOMIC LAYER DEPOSITION,DIELECTRIC-CONSTANT MATERIALS,ELLIPSOMETRIC POROSIMETRY,BARRIER LAYER,SILICA,INTERCONNECTS,INTEGRATION,CHALLENGES,RESISTANCE,IMPACT},
  language     = {eng},
  number       = {25},
  pages        = {3961--3966},
  title        = {Sealed ultra low-k organosilica films with improved electrical, mechanical and chemical properties},
  url          = {http://dx.doi.org/10.1039/c3tc30522h},
  volume       = {1},
  year         = {2013},
}

Chicago
Goethals, Frederik, Elisabeth Levrau, Glenn Pollefeyt, Mikhail R Baklanov, Ivan Ciofi, Kris Vanstreels, Christophe Detavernier, Isabel Van Driessche, and Pascal Van Der Voort. 2013. “Sealed Ultra Low-k Organosilica Films with Improved Electrical, Mechanical and Chemical Properties.” Journal of Materials Chemistry C 1 (25): 3961–3966.
APA
Goethals, Frederik, Levrau, E., Pollefeyt, G., Baklanov, M. R., Ciofi, I., Vanstreels, K., Detavernier, C., et al. (2013). Sealed ultra low-k organosilica films with improved electrical, mechanical and chemical properties. JOURNAL OF MATERIALS CHEMISTRY C, 1(25), 3961–3966.
Vancouver
1.
Goethals F, Levrau E, Pollefeyt G, Baklanov MR, Ciofi I, Vanstreels K, et al. Sealed ultra low-k organosilica films with improved electrical, mechanical and chemical properties. JOURNAL OF MATERIALS CHEMISTRY C. 2013;1(25):3961–6.
MLA
Goethals, Frederik, Elisabeth Levrau, Glenn Pollefeyt, et al. “Sealed Ultra Low-k Organosilica Films with Improved Electrical, Mechanical and Chemical Properties.” JOURNAL OF MATERIALS CHEMISTRY C 1.25 (2013): 3961–3966. Print.