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Electrochemical study of copper deposition on silicon surfaces in HF solutions

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Chicago
TEERLINCK, I, WP GOMES, Katrien Strubbe, PW MERTENS, and MM HEYNS. 1999. “Electrochemical Study of Copper Deposition on Silicon Surfaces in HF Solutions.” Electrochemical Processing in Ulsi Fabrication and Semiconductor/metal Deposition Ii, Proceedings 99 (9): 156–159.
APA
TEERLINCK, I., GOMES, W., Strubbe, K., MERTENS, P., & HEYNS, M. (1999). Electrochemical study of copper deposition on silicon surfaces in HF solutions. ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION AND SEMICONDUCTOR/METAL DEPOSITION II, PROCEEDINGS, 99(9), 156–159.
Vancouver
1.
TEERLINCK I, GOMES W, Strubbe K, MERTENS P, HEYNS M. Electrochemical study of copper deposition on silicon surfaces in HF solutions. ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION AND SEMICONDUCTOR/METAL DEPOSITION II, PROCEEDINGS. 1999;99(9):156–9.
MLA
TEERLINCK, I, WP GOMES, Katrien Strubbe, et al. “Electrochemical Study of Copper Deposition on Silicon Surfaces in HF Solutions.” ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION AND SEMICONDUCTOR/METAL DEPOSITION II, PROCEEDINGS 99.9 (1999): 156–159. Print.
@article{407093,
  author       = {TEERLINCK, I and GOMES, WP and Strubbe, Katrien and MERTENS, PW and HEYNS, MM},
  journal      = {ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION AND SEMICONDUCTOR/METAL DEPOSITION II, PROCEEDINGS},
  language     = {eng},
  number       = {9},
  pages        = {156--159},
  title        = {Electrochemical study of copper deposition on silicon surfaces in HF solutions},
  volume       = {99},
  year         = {1999},
}

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