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Optical connections on flexible substrates

Erwin Bosman (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Geert Van Steenberge (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)
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Abstract
Optical interconnections integrated on a flexible substrate combine the advantages of optical data transmissions (high bandwidth, no electromagnetic disturbance and low power consumption) and those of flexible substrates (compact, ease of assembly...). Especially the flexible character of the substrates can significantly lower the assembly cost and leads to more compact modules. Especially in automotive-, avionic-, biomedical and sensing applications there is a great potential for these flexible optical interconnections because of the increasing data-rates, increasing use of optical sensors and requirement for smaller size and weight. The research concentrates on the integration of commercially available polymer optical layers (Truemode Backplane (TM) Polymer, Ormocer (R)) on a flexible Polyimide film, the fabrication of waveguides and out-of plane deflecting 45 degrees mirrors, the characterization of the optical losses due to the bending of the substrate, and the fabrication of a proof-of-principal demonstrator. The resulting optical structures should be compatible with the standard fabrication of flexible printed circuit boards.
Keywords
waveguide, mirror, flexible, optical, interconnection, polyimide

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Chicago
Bosman, Erwin, Peter Geerinck, Wim Christiaens, Geert Van Steenberge, Jan Vanfleteren, and Peter Van Daele. 2006. “Optical Connections on Flexible Substrates.” In Proceedings of SPIE, the International Society for Optical Engineering, ed. Hugo Thienpont, Mohammad R Taghizadeh, Peter Van Daele, and Jürgen Mohr. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
APA
Bosman, E., Geerinck, P., Christiaens, W., Van Steenberge, G., Vanfleteren, J., & Van Daele, P. (2006). Optical connections on flexible substrates. In Hugo Thienpont, M. R. Taghizadeh, P. Van Daele, & J. Mohr (Eds.), Proceedings of SPIE, the International Society for Optical Engineering. Presented at the Conference on Micro-Optics, VCSELs, and Photonic Interconnects II, Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Vancouver
1.
Bosman E, Geerinck P, Christiaens W, Van Steenberge G, Vanfleteren J, Van Daele P. Optical connections on flexible substrates. In: Thienpont H, Taghizadeh MR, Van Daele P, Mohr J, editors. Proceedings of SPIE, the International Society for Optical Engineering. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering; 2006.
MLA
Bosman, Erwin, Peter Geerinck, Wim Christiaens, et al. “Optical Connections on Flexible Substrates.” Proceedings of SPIE, the International Society for Optical Engineering. Ed. Hugo Thienpont et al. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering, 2006. Print.
@inproceedings{406162,
  abstract     = {Optical interconnections integrated on a flexible substrate combine the advantages of optical data transmissions (high bandwidth, no electromagnetic disturbance and low power consumption) and those of flexible substrates (compact, ease of assembly...). Especially the flexible character of the substrates can significantly lower the assembly cost and leads to more compact modules. Especially in automotive-, avionic-, biomedical and sensing applications there is a great potential for these flexible optical interconnections because of the increasing data-rates, increasing use of optical sensors and requirement for smaller size and weight. The research concentrates on the integration of commercially available polymer optical layers (Truemode Backplane (TM) Polymer, Ormocer (R)) on a flexible Polyimide film, the fabrication of waveguides and out-of plane deflecting 45 degrees mirrors, the characterization of the optical losses due to the bending of the substrate, and the fabrication of a proof-of-principal demonstrator. The resulting optical structures should be compatible with the standard fabrication of flexible printed circuit boards.},
  articleno    = {618506},
  author       = {Bosman, Erwin and Geerinck, Peter and Christiaens, Wim and Van Steenberge, Geert and Vanfleteren, Jan and Van Daele, Peter},
  booktitle    = {Proceedings of SPIE, the International Society for Optical Engineering},
  editor       = {Thienpont, Hugo and Taghizadeh, Mohammad R and Van Daele, Peter and Mohr, J{\"u}rgen},
  isbn         = {9780819462411},
  issn         = {0277-786X},
  language     = {eng},
  location     = {Strasbourg, France},
  pages        = {8},
  publisher    = {SPIE, the International Society for Optical Engineering},
  title        = {Optical connections on flexible substrates},
  url          = {http://dx.doi.org/10.1117/12.663620},
  year         = {2006},
}

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