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Abstract
This paper describes a complete technology family for parallel optical interconnect systems. Key features are the two-dimensional on-chip optical access and the development of a complete optical pathway. This covers both chip-to-chip links on a single boards, chip-to-chip links over an optical backpanel, and even system-to-system interconnects. Therefore it is a scalable technology. The design of all parts of the link, and the integration of parallel optical interconnect systems in the design flow of electronic systems is presented in this paper.
Keywords
ARRAYS, CIRCUIT, parallel optical interconnects, TECHNOLOGY

Citation

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MLA
Bockstaele, Ronny, et al. “A Parallel Optical Interconnect Link with On-Chip Optical Access.” PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), edited by Hugo Thienpont et al., vol. 5453, SPIE, the International Society for Optical Engineering, 2004, pp. 124–33, doi:10.1117/12.545490.
APA
Bockstaele, R., De Wilde, M., Meeus, W., Rits, O., Lambrecht, H., Van Campenhout, J., … Baets, R. (2004). A parallel optical interconnect link with on-chip optical access. In H. Thienpont, K. D. Choquette, & M. R. Taghizadeh (Eds.), PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE) (Vol. 5453, pp. 124–133). https://doi.org/10.1117/12.545490
Chicago author-date
Bockstaele, Ronny, Michiel De Wilde, Wim Meeus, Olivier Rits, Hannes Lambrecht, Jan Van Campenhout, Johan De Baets, et al. 2004. “A Parallel Optical Interconnect Link with On-Chip Optical Access.” In PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), edited by Hugo Thienpont, Kent D Choquette, and Mohammad R Taghizadeh, 5453:124–33. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering. https://doi.org/10.1117/12.545490.
Chicago author-date (all authors)
Bockstaele, Ronny, Michiel De Wilde, Wim Meeus, Olivier Rits, Hannes Lambrecht, Jan Van Campenhout, Johan De Baets, Peter Van Daele, Eric van den Berg, Michaela Klemenc, Sven Eitel, Richard Annen, Jan Van Koetsem, Gilles Widawski, Jacques Goudeau, Baudouin Bareel, Patrick Le Moine, Reto Fries, Peter Straub, François Marion, Julien Routin, and Roel Baets. 2004. “A Parallel Optical Interconnect Link with On-Chip Optical Access.” In PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), ed by. Hugo Thienpont, Kent D Choquette, and Mohammad R Taghizadeh, 5453:124–133. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering. doi:10.1117/12.545490.
Vancouver
1.
Bockstaele R, De Wilde M, Meeus W, Rits O, Lambrecht H, Van Campenhout J, et al. A parallel optical interconnect link with on-chip optical access. In: Thienpont H, Choquette KD, Taghizadeh MR, editors. PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). Bellingham, WA, USA: SPIE, the International Society for Optical Engineering; 2004. p. 124–33.
IEEE
[1]
R. Bockstaele et al., “A parallel optical interconnect link with on-chip optical access,” in PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), Strasbourg, France, 2004, vol. 5453, pp. 124–133.
@inproceedings{404356,
  abstract     = {{This paper describes a complete technology family for parallel optical interconnect systems. Key features are the two-dimensional on-chip optical access and the development of a complete optical pathway. This covers both chip-to-chip links on a single boards, chip-to-chip links over an optical backpanel, and even system-to-system interconnects. Therefore it is a scalable technology. The design of all parts of the link, and the integration of parallel optical interconnect systems in the design flow of electronic systems is presented in this paper.}},
  author       = {{Bockstaele, Ronny and De Wilde, Michiel and Meeus, Wim and Rits, Olivier and Lambrecht, Hannes and Van Campenhout, Jan and De Baets, Johan and Van Daele, Peter and van den Berg, Eric and Klemenc, Michaela and Eitel, Sven and Annen, Richard and Van Koetsem, Jan and Widawski, Gilles and Goudeau, Jacques and Bareel, Baudouin and Le Moine, Patrick and Fries, Reto and Straub, Peter and Marion, François and Routin, Julien and Baets, Roel}},
  booktitle    = {{PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)}},
  editor       = {{Thienpont, Hugo and Choquette, Kent D and Taghizadeh, Mohammad R}},
  isbn         = {{0-8194-5376-5}},
  issn         = {{0277-786X}},
  keywords     = {{ARRAYS,CIRCUIT,parallel optical interconnects,TECHNOLOGY}},
  language     = {{eng}},
  location     = {{Strasbourg, France}},
  pages        = {{124--133}},
  publisher    = {{SPIE, the International Society for Optical Engineering}},
  title        = {{A parallel optical interconnect link with on-chip optical access}},
  url          = {{http://dx.doi.org/10.1117/12.545490}},
  volume       = {{5453}},
  year         = {{2004}},
}

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