
Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes
- Author
- Herbert De Pauw (UGent) , Johan De Baets (UGent) , Jan Vanfleteren (UGent) and André Van Calster (UGent)
- Organization
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-404090
- MLA
- De Pauw, Herbert, et al. “Integrated Optics in a Standard MCM-D Motherboard Technology Demonstrated in O/E Measurement Probes.” ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, AMER SOC MECHANICAL ENGINEERS, 2003, pp. 169–76.
- APA
- De Pauw, H., De Baets, J., Vanfleteren, J., & Van Calster, A. (2003). Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes. ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 169–176. AMER SOC MECHANICAL ENGINEERS.
- Chicago author-date
- De Pauw, Herbert, Johan De Baets, Jan Vanfleteren, and André Van Calster. 2003. “Integrated Optics in a Standard MCM-D Motherboard Technology Demonstrated in O/E Measurement Probes.” In ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 169–76. AMER SOC MECHANICAL ENGINEERS.
- Chicago author-date (all authors)
- De Pauw, Herbert, Johan De Baets, Jan Vanfleteren, and André Van Calster. 2003. “Integrated Optics in a Standard MCM-D Motherboard Technology Demonstrated in O/E Measurement Probes.” In ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 169–176. AMER SOC MECHANICAL ENGINEERS.
- Vancouver
- 1.De Pauw H, De Baets J, Vanfleteren J, Van Calster A. Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes. In: ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1. AMER SOC MECHANICAL ENGINEERS; 2003. p. 169–76.
- IEEE
- [1]H. De Pauw, J. De Baets, J. Vanfleteren, and A. Van Calster, “Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes,” in ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, pp. 169–176.
@inproceedings{404090, author = {{De Pauw, Herbert and De Baets, Johan and Vanfleteren, Jan and Van Calster, André}}, booktitle = {{ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1}}, isbn = {{0-7918-3690-8}}, language = {{eng}}, pages = {{169--176}}, publisher = {{AMER SOC MECHANICAL ENGINEERS}}, title = {{Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes}}, year = {{2003}}, }