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MT compatible red VCSEL module for parallel optical interconnections

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Abstract
In this paper we present the design, fabrication and characterization of a module which directly connectorises a 1x8 red VCSEL array to a small diameter (125 mu m diameter) polymer optical fiber (POF) array, using a standard MT ferrule. The facets of the POF are prepared by a hot knife cutting, followed by a short polishing step. First coupling results show total losses (attenuation-, misalignment-, Fresnel- and NA mismatch losses included) in the range of 1.1 dB/channel for a 30 cm POF link. Optical crosstalk between adjacent channels is below -45 dB. Plastic micromachined parts surrounding the VCSEL chip ensure the correct alignment of the connector, using the connector guiding pins. The parts themselves are aligned to the chip with an index-alignment technique, using an excimer laser ablated mastertool. In a deconnectorisable version of the module, a thin, flat glue layer on the chip acts as a window between the VCSEL chip and the MT terminated POF array. Integrated in a standard ceramic package, clear eye diagrams have been measured at 150 MHz for a 10m POF link, coupled to the VCSEL array. Further efforts on higher speed measurements using dedicated drivers, will also be presented.

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MLA
Van Hove, An, Koen Vandeputte, Kris Naessens, et al. “MT Compatible Red VCSEL Module for Parallel Optical Interconnections.” Proceedings of SPIE, the International Society for Optical Engineering. Ed. Michael R Feldman et al. Vol. 3952. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering, 2000. 134–143. Print.
APA
Van Hove, A., Vandeputte, K., Naessens, K., Dhoedt, B., Baets, R., & Van Daele, P. (2000). MT compatible red VCSEL module for parallel optical interconnections. In M. R. Feldman, R. L. Li, W. B. Matkin, & S. Tang (Eds.), Proceedings of SPIE, the International Society for Optical Engineering (Vol. 3952, pp. 134–143). Presented at the Conference on Optoelectronic Interconnects VII ; Photonics Packaging and Integration II, Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Chicago author-date
Van Hove, An, Koen Vandeputte, Kris Naessens, Bart Dhoedt, Roel Baets, and Peter Van Daele. 2000. “MT Compatible Red VCSEL Module for Parallel Optical Interconnections.” In Proceedings of SPIE, the International Society for Optical Engineering, ed. Michael R Feldman, Richard L Li, W Brian Matkin, and Suning Tang, 3952:134–143. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Chicago author-date (all authors)
Van Hove, An, Koen Vandeputte, Kris Naessens, Bart Dhoedt, Roel Baets, and Peter Van Daele. 2000. “MT Compatible Red VCSEL Module for Parallel Optical Interconnections.” In Proceedings of SPIE, the International Society for Optical Engineering, ed. Michael R Feldman, Richard L Li, W Brian Matkin, and Suning Tang, 3952:134–143. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Vancouver
1.
Van Hove A, Vandeputte K, Naessens K, Dhoedt B, Baets R, Van Daele P. MT compatible red VCSEL module for parallel optical interconnections. In: Feldman MR, Li RL, Matkin WB, Tang S, editors. Proceedings of SPIE, the International Society for Optical Engineering. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering; 2000. p. 134–43.
IEEE
[1]
A. Van Hove, K. Vandeputte, K. Naessens, B. Dhoedt, R. Baets, and P. Van Daele, “MT compatible red VCSEL module for parallel optical interconnections,” in Proceedings of SPIE, the International Society for Optical Engineering, San José, CA, USA, 2000, vol. 3952, pp. 134–143.
@inproceedings{400772,
  abstract     = {In this paper we present the design, fabrication and characterization of a module which directly connectorises a 1x8 red VCSEL array to a small diameter (125 mu m diameter) polymer optical fiber (POF) array, using a standard MT ferrule. The facets of the POF are prepared by a hot knife cutting, followed by a short polishing step. First coupling results show total losses (attenuation-, misalignment-, Fresnel- and NA mismatch losses included) in the range of 1.1 dB/channel for a 30 cm POF link. Optical crosstalk between adjacent channels is below -45 dB. Plastic micromachined parts surrounding the VCSEL chip ensure the correct alignment of the connector, using the connector guiding pins. The parts themselves are aligned to the chip with an index-alignment technique, using an excimer laser ablated mastertool.
In a deconnectorisable version of the module, a thin, flat glue layer on the chip acts as a window between the VCSEL chip and the MT terminated POF array. Integrated in a standard ceramic package, clear eye diagrams have been measured at 150 MHz for a 10m POF link, coupled to the VCSEL array. Further efforts on higher speed measurements using dedicated drivers, will also be presented.},
  author       = {Van Hove, An and Vandeputte, Koen and Naessens, Kris and Dhoedt, Bart and Baets, Roel and Van Daele, Peter},
  booktitle    = {Proceedings of SPIE, the International Society for Optical Engineering},
  editor       = {Feldman, Michael R and Li, Richard L and Matkin, W Brian and Tang, Suning},
  isbn         = {0-8194-3569-4},
  issn         = {0277-786X},
  language     = {eng},
  location     = {San José, CA, USA},
  pages        = {134--143},
  publisher    = {SPIE, the International Society for Optical Engineering},
  title        = {MT compatible red VCSEL module for parallel optical interconnections},
  url          = {http://dx.doi.org/10.1117/12.384392},
  volume       = {3952},
  year         = {2000},
}

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