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Influence of deposition on the reactive sputter behaviour during rotating cylindrical magnetron sputtering

XiuYang Li, Diederik Depla (UGent) , Wouter Leroy (UGent) , Johan Haemers (UGent) and Roger De Gryse (UGent)
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Abstract
A key feature of a rotating cylindrical magnetron is the changing race track position due to target rotation. To study the reactive magnetron sputtering of aluminium for this magnetron type, so-called sputter cleaning experiments were designed. In these experiments, the target was first sputtered without rotating the target. After this treatment, the target was sputter cleaned in pure argon while rotating the target. In the meantime, the discharge voltage was recorded as a function of time. The obtained results can be understood by including compound deposition on the target as an extra mechanism for target poisoning.

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Chicago
Li, XiuYang, Diederik Depla, Wouter Leroy, Johan Haemers, and Roger De Gryse. 2008. “Influence of Deposition on the Reactive Sputter Behaviour During Rotating Cylindrical Magnetron Sputtering.” Journal of Physics D-applied Physics 41 (3).
APA
Li, XiuYang, Depla, D., Leroy, W., Haemers, J., & De Gryse, R. (2008). Influence of deposition on the reactive sputter behaviour during rotating cylindrical magnetron sputtering. JOURNAL OF PHYSICS D-APPLIED PHYSICS, 41(3).
Vancouver
1.
Li X, Depla D, Leroy W, Haemers J, De Gryse R. Influence of deposition on the reactive sputter behaviour during rotating cylindrical magnetron sputtering. JOURNAL OF PHYSICS D-APPLIED PHYSICS. 2008;41(3).
MLA
Li, XiuYang, Diederik Depla, Wouter Leroy, et al. “Influence of Deposition on the Reactive Sputter Behaviour During Rotating Cylindrical Magnetron Sputtering.” JOURNAL OF PHYSICS D-APPLIED PHYSICS 41.3 (2008): n. pag. Print.
@article{392935,
  abstract     = {A key feature of a rotating cylindrical magnetron is the changing race track position due to target rotation. To study the reactive magnetron sputtering of aluminium for this magnetron type, so-called sputter cleaning experiments were designed. In these experiments, the target was first sputtered without rotating the target. After this treatment, the target was sputter cleaned in pure argon while rotating the target. In the meantime, the discharge voltage was recorded as a function of time. The obtained results can be understood by including compound deposition on the target as an extra mechanism for target poisoning.},
  articleno    = {035203},
  author       = {Li, XiuYang and Depla, Diederik and Leroy, Wouter and Haemers, Johan and De Gryse, Roger},
  issn         = {0022-3727},
  journal      = {JOURNAL OF PHYSICS D-APPLIED PHYSICS},
  language     = {eng},
  number       = {3},
  pages        = {6},
  title        = {Influence of deposition on the reactive sputter behaviour during rotating cylindrical magnetron sputtering},
  url          = {http://dx.doi.org/10.1088/0022-3727/41/3/035203},
  volume       = {41},
  year         = {2008},
}

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