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III-V/Si photonics by die to wafer bonding

(2007) MATERIALS TODAY. 10(7-8). p.36-43
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Citation

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MLA
Roelkens, Günther et al. “III-V/Si Photonics by Die to Wafer Bonding.” MATERIALS TODAY 10.7-8 (2007): 36–43. Print.
APA
Roelkens, Günther, Van Campenhout, J., Brouckaert, J., Van Thourhout, D., Baets, R., ROMEO, P., REGRENY, P., et al. (2007). III-V/Si photonics by die to wafer bonding. MATERIALS TODAY, 10(7-8), 36–43.
Chicago author-date
Roelkens, Günther, Joris Van Campenhout, Joost Brouckaert, Dries Van Thourhout, Roel Baets, PR ROMEO, P REGRENY, et al. 2007. “III-V/Si Photonics by Die to Wafer Bonding.” Materials Today 10 (7-8): 36–43.
Chicago author-date (all authors)
Roelkens, Günther, Joris Van Campenhout, Joost Brouckaert, Dries Van Thourhout, Roel Baets, PR ROMEO, P REGRENY, A KAZMIERCZAK, C SEASSAL, X LETARTRE, G HOLLINGER, JM FEDELI, L DI CIOCCIO, and C LAGAHE-BLANCHARD. 2007. “III-V/Si Photonics by Die to Wafer Bonding.” Materials Today 10 (7-8): 36–43.
Vancouver
1.
Roelkens G, Van Campenhout J, Brouckaert J, Van Thourhout D, Baets R, ROMEO P, et al. III-V/Si photonics by die to wafer bonding. MATERIALS TODAY. ELSEVIER SCI LTD; 2007;10(7-8):36–43.
IEEE
[1]
G. Roelkens et al., “III-V/Si photonics by die to wafer bonding,” MATERIALS TODAY, vol. 10, no. 7–8, pp. 36–43, 2007.
@article{389064,
  author       = {{Roelkens, Günther and Van Campenhout, Joris and Brouckaert, Joost and Van Thourhout, Dries and Baets, Roel and ROMEO, PR and REGRENY, P and KAZMIERCZAK, A and SEASSAL, C and LETARTRE, X and HOLLINGER, G and FEDELI, JM and DI CIOCCIO, L and LAGAHE-BLANCHARD, C}},
  issn         = {{1369-7021}},
  journal      = {{MATERIALS TODAY}},
  language     = {{eng}},
  number       = {{7-8}},
  pages        = {{36--43}},
  publisher    = {{ELSEVIER SCI LTD}},
  title        = {{III-V/Si photonics by die to wafer bonding}},
  url          = {{http://dx.doi.org/1854/9373}},
  volume       = {{10}},
  year         = {{2007}},
}

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