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III-V/Si photonics by die to wafer bonding

(2007) MATERIALS TODAY. 10(7-8). p.36-43
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Chicago
Roelkens, Günther, Joris Van Campenhout, Joost Brouckaert, Dries Van Thourhout, Roel Baets, PR ROMEO, P REGRENY, et al. 2007. “III-V/Si Photonics by Die to Wafer Bonding.” Materials Today 10 (7-8): 36–43.
APA
Roelkens, G., Van Campenhout, J., Brouckaert, J., Van Thourhout, D., Baets, R., ROMEO, P., REGRENY, P., et al. (2007). III-V/Si photonics by die to wafer bonding. MATERIALS TODAY, 10(7-8), 36–43.
Vancouver
1.
Roelkens G, Van Campenhout J, Brouckaert J, Van Thourhout D, Baets R, ROMEO P, et al. III-V/Si photonics by die to wafer bonding. MATERIALS TODAY. ELSEVIER SCI LTD; 2007;10(7-8):36–43.
MLA
Roelkens, Günther, Joris Van Campenhout, Joost Brouckaert, et al. “III-V/Si Photonics by Die to Wafer Bonding.” MATERIALS TODAY 10.7-8 (2007): 36–43. Print.
@article{389064,
  author       = {Roelkens, G{\"u}nther and Van Campenhout, Joris and Brouckaert, Joost and Van Thourhout, Dries and Baets, Roel and ROMEO, PR and REGRENY, P and KAZMIERCZAK, A and SEASSAL, C and LETARTRE, X and HOLLINGER, G and FEDELI, JM and DI CIOCCIO, L and LAGAHE-BLANCHARD, C},
  issn         = {1369-7021},
  journal      = {MATERIALS TODAY},
  language     = {eng},
  number       = {7-8},
  pages        = {36--43},
  publisher    = {ELSEVIER SCI LTD},
  title        = {III-V/Si photonics by die to wafer bonding},
  url          = {http://dx.doi.org/1854/9373},
  volume       = {10},
  year         = {2007},
}

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