- Author
- Günther Roelkens (UGent) , Joris Van Campenhout, Joost Brouckaert (UGent) , Dries Van Thourhout (UGent) , Roel Baets (UGent) , PR ROMEO, P REGRENY, A KAZMIERCZAK, C SEASSAL, X LETARTRE, G HOLLINGER, JM FEDELI, L DI CIOCCIO and C LAGAHE-BLANCHARD
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Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-389064
- MLA
- Roelkens, Günther, et al. “III-V/Si Photonics by Die to Wafer Bonding.” MATERIALS TODAY, vol. 10, no. 7–8, ELSEVIER SCI LTD, 2007, pp. 36–43, doi:1854/9373.
- APA
- Roelkens, G., Van Campenhout, J., Brouckaert, J., Van Thourhout, D., Baets, R., ROMEO, P., … LAGAHE-BLANCHARD, C. (2007). III-V/Si photonics by die to wafer bonding. MATERIALS TODAY, 10(7–8), 36–43. https://doi.org/1854/9373
- Chicago author-date
- Roelkens, Günther, Joris Van Campenhout, Joost Brouckaert, Dries Van Thourhout, Roel Baets, PR ROMEO, P REGRENY, et al. 2007. “III-V/Si Photonics by Die to Wafer Bonding.” MATERIALS TODAY 10 (7–8): 36–43. https://doi.org/1854/9373.
- Chicago author-date (all authors)
- Roelkens, Günther, Joris Van Campenhout, Joost Brouckaert, Dries Van Thourhout, Roel Baets, PR ROMEO, P REGRENY, A KAZMIERCZAK, C SEASSAL, X LETARTRE, G HOLLINGER, JM FEDELI, L DI CIOCCIO, and C LAGAHE-BLANCHARD. 2007. “III-V/Si Photonics by Die to Wafer Bonding.” MATERIALS TODAY 10 (7–8): 36–43. doi:1854/9373.
- Vancouver
- 1.Roelkens G, Van Campenhout J, Brouckaert J, Van Thourhout D, Baets R, ROMEO P, et al. III-V/Si photonics by die to wafer bonding. MATERIALS TODAY. 2007;10(7–8):36–43.
- IEEE
- [1]G. Roelkens et al., “III-V/Si photonics by die to wafer bonding,” MATERIALS TODAY, vol. 10, no. 7–8, pp. 36–43, 2007.
@article{389064,
author = {{Roelkens, Günther and Van Campenhout, Joris and Brouckaert, Joost and Van Thourhout, Dries and Baets, Roel and ROMEO, PR and REGRENY, P and KAZMIERCZAK, A and SEASSAL, C and LETARTRE, X and HOLLINGER, G and FEDELI, JM and DI CIOCCIO, L and LAGAHE-BLANCHARD, C}},
issn = {{1369-7021}},
journal = {{MATERIALS TODAY}},
language = {{eng}},
number = {{7-8}},
pages = {{36--43}},
publisher = {{ELSEVIER SCI LTD}},
title = {{III-V/Si photonics by die to wafer bonding}},
url = {{http://doi.org/1854/9373}},
volume = {{10}},
year = {{2007}},
}
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