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Ultra-thin chip package using embedding in spin-on polyimides

Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)
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Citation

Please use this url to cite or link to this publication:

Chicago
Christiaens, Wim, Erwin Bosman, and Jan Vanfleteren. 2006. “Ultra-thin Chip Package Using Embedding in Spin-on Polyimides.” Good-die Newsletter (19): 41–44.
APA
Christiaens, Wim, Bosman, E., & Vanfleteren, J. (2006). Ultra-thin chip package using embedding in spin-on polyimides. GOOD-DIE NEWSLETTER, (19), 41–44.
Vancouver
1.
Christiaens W, Bosman E, Vanfleteren J. Ultra-thin chip package using embedding in spin-on polyimides. GOOD-DIE NEWSLETTER. 2006;(19):41–4.
MLA
Christiaens, Wim, Erwin Bosman, and Jan Vanfleteren. “Ultra-thin Chip Package Using Embedding in Spin-on Polyimides.” GOOD-DIE NEWSLETTER 19 (2006): 41–44. Print.
@article{388195,
  author       = {Christiaens, Wim and Bosman, Erwin and Vanfleteren, Jan},
  journal      = {GOOD-DIE NEWSLETTER},
  language     = {eng},
  number       = {19},
  pages        = {41--44},
  title        = {Ultra-thin chip package using embedding in spin-on polyimides},
  year         = {2006},
}