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Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections

J VAN ERPS, Nina Hendrickx UGent, C DEBAES, Peter Van Daele UGent and Hugo Thienpont UGent (2007) Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference. p.70-75
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference
pages
70-75 pages
ISBN
978-952-99751-1-2-(PAPER-BACK)-OR-78-952-99751-2-9-(CD-ROM)
DOI
1854/8929
UGent publication?
yes
classification
C1
id
384849
handle
http://hdl.handle.net/1854/LU-384849
date created
2008-01-18 15:47:00
date last changed
2008-02-22 23:02:38
@inproceedings{384849,
  author       = {VAN ERPS, J and Hendrickx, Nina and DEBAES, C and Van Daele, Peter and Thienpont, Hugo},
  booktitle    = {Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference},
  isbn         = {978-952-99751-1-2-(PAPER-BACK)-OR-78-952-99751-2-9-(CD-ROM)},
  pages        = {70--75},
  title        = {Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections},
  url          = {http://dx.doi.org/1854/8929},
  year         = {2007},
}

Chicago
VAN ERPS, J, Nina Hendrickx, C DEBAES, Peter Van Daele, and Hugo Thienpont. 2007. “Prototyping of Pluggable Out-of-plane Coupling Components for Multilayer Board-level Optical Interconnections.” In Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference, 70–75.
APA
VAN ERPS, J., Hendrickx, N., DEBAES, C., Van Daele, P., & Thienpont, H. (2007). Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections. Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference (pp. 70–75).
Vancouver
1.
VAN ERPS J, Hendrickx N, DEBAES C, Van Daele P, Thienpont H. Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections. Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference. 2007. p. 70–5.
MLA
VAN ERPS, J, Nina Hendrickx, C DEBAES, et al. “Prototyping of Pluggable Out-of-plane Coupling Components for Multilayer Board-level Optical Interconnections.” Proceedings of the EMPC 2007 - IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference. 2007. 70–75. Print.