Advanced search

Ultra-thin chip package using embedding in spin-on polyimides

Wim Christiaens (UGent) , Erwin Bosman (UGent) and Jan Vanfleteren (UGent)
Author
Organization
Keywords
Embedded chips

Citation

Please use this url to cite or link to this publication:

Chicago
Christiaens, Wim, Erwin Bosman, and Jan Vanfleteren. 2006. “Ultra-thin Chip Package Using Embedding in Spin-on Polyimides.” In European Microelectronics and Packaging Symposium, 4th, Proceedings, 125–128.
APA
Christiaens, Wim, Bosman, E., & Vanfleteren, J. (2006). Ultra-thin chip package using embedding in spin-on polyimides. European Microelectronics and Packaging Symposium, 4th, Proceedings (pp. 125–128). Presented at the 4th European Microelectronics and Packaging Symposium (EMPS 2006).
Vancouver
1.
Christiaens W, Bosman E, Vanfleteren J. Ultra-thin chip package using embedding in spin-on polyimides. European Microelectronics and Packaging Symposium, 4th, Proceedings. 2006. p. 125–8.
MLA
Christiaens, Wim, Erwin Bosman, and Jan Vanfleteren. “Ultra-thin Chip Package Using Embedding in Spin-on Polyimides.” European Microelectronics and Packaging Symposium, 4th, Proceedings. 2006. 125–128. Print.
@inproceedings{374748,
  author       = {Christiaens, Wim and Bosman, Erwin and Vanfleteren, Jan},
  booktitle    = {European Microelectronics and Packaging Symposium, 4th, Proceedings},
  language     = {eng},
  location     = {Terme Catez, Slovenia},
  pages        = {125--128},
  title        = {Ultra-thin chip package using embedding in spin-on polyimides},
  year         = {2006},
}