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Elastic interconnects for stretchable electronic circuits using MID (moulded interconnect device) technology

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Please use this url to cite or link to this publication:

MLA
Brosteaux, Dominique, Fabrice Axisa, Jan Vanfleteren, et al. “Elastic Interconnects for Stretchable Electronic Circuits Using MID (moulded Interconnect Device) Technology.” MRS Spring Meeting. 2006. Print.
APA
Brosteaux, D., Axisa, F., Vanfleteren, J., Carchon, N., & GONZALEZ, M. (2006). Elastic interconnects for stretchable electronic circuits using MID (moulded interconnect device) technology. MRS Spring meeting.
Chicago author-date
Brosteaux, Dominique, Fabrice Axisa, Jan Vanfleteren, Nadine Carchon, and M GONZALEZ. 2006. “Elastic Interconnects for Stretchable Electronic Circuits Using MID (moulded Interconnect Device) Technology.” In MRS Spring Meeting.
Chicago author-date (all authors)
Brosteaux, Dominique, Fabrice Axisa, Jan Vanfleteren, Nadine Carchon, and M GONZALEZ. 2006. “Elastic Interconnects for Stretchable Electronic Circuits Using MID (moulded Interconnect Device) Technology.” In MRS Spring Meeting.
Vancouver
1.
Brosteaux D, Axisa F, Vanfleteren J, Carchon N, GONZALEZ M. Elastic interconnects for stretchable electronic circuits using MID (moulded interconnect device) technology. MRS Spring meeting. 2006.
IEEE
[1]
D. Brosteaux, F. Axisa, J. Vanfleteren, N. Carchon, and M. GONZALEZ, “Elastic interconnects for stretchable electronic circuits using MID (moulded interconnect device) technology,” in MRS Spring meeting, 2006.
@inproceedings{374580,
  author       = {Brosteaux, Dominique and Axisa, Fabrice and Vanfleteren, Jan and Carchon, Nadine and GONZALEZ, M},
  booktitle    = {MRS Spring meeting},
  language     = {eng},
  title        = {Elastic interconnects for stretchable electronic circuits using MID (moulded interconnect device) technology},
  year         = {2006},
}