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Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam Siau, Alfons Vervaet (UGent) , Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)
(2006) APPLIED SURFACE SCIENCE. 252(8). p.2717-2740
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MLA
Siau, Sam, et al. “Qualitative Electroless Ni/Au Plating Considerations for the Solder Mask on Top of Sequential Build-up Layers.” APPLIED SURFACE SCIENCE, vol. 252, no. 8, Elsevier Science, 2006, pp. 2717–40.
APA
Siau, S., Vervaet, A., Degrendele, L., De Baets, J., & Van Calster, A. (2006). Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers. APPLIED SURFACE SCIENCE, 252(8), 2717–2740.
Chicago author-date
Siau, Sam, Alfons Vervaet, Lieven Degrendele, Johan De Baets, and André Van Calster. 2006. “Qualitative Electroless Ni/Au Plating Considerations for the Solder Mask on Top of Sequential Build-up Layers.” APPLIED SURFACE SCIENCE 252 (8): 2717–40.
Chicago author-date (all authors)
Siau, Sam, Alfons Vervaet, Lieven Degrendele, Johan De Baets, and André Van Calster. 2006. “Qualitative Electroless Ni/Au Plating Considerations for the Solder Mask on Top of Sequential Build-up Layers.” APPLIED SURFACE SCIENCE 252 (8): 2717–2740.
Vancouver
1.
Siau S, Vervaet A, Degrendele L, De Baets J, Van Calster A. Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers. APPLIED SURFACE SCIENCE. 2006;252(8):2717–40.
IEEE
[1]
S. Siau, A. Vervaet, L. Degrendele, J. De Baets, and A. Van Calster, “Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers,” APPLIED SURFACE SCIENCE, vol. 252, no. 8, pp. 2717–2740, 2006.
@article{365315,
  author       = {{Siau, Sam and Vervaet, Alfons and Degrendele, Lieven and De Baets, Johan and Van Calster, André}},
  issn         = {{0169-4332}},
  journal      = {{APPLIED SURFACE SCIENCE}},
  language     = {{eng}},
  number       = {{8}},
  pages        = {{2717--2740}},
  publisher    = {{Elsevier Science}},
  title        = {{Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers}},
  volume       = {{252}},
  year         = {{2006}},
}
Web of Science
Times cited: