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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Sam Siau, Alfons Vervaet (UGent) , L VAN VAECK, Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)
(2005) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 152(6).
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Citation

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MLA
Siau, Sam, et al. “Adhesion Strength of the Epoxy Polymer/Copper Interface for Use in Microelectronics.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 152, no. 6, ELECTROCHEMICAL SOC INC, 2005, p. 442.
APA
Siau, S., Vervaet, A., VAN VAECK, L., Schacht, E., Demeter, U., & Van Calster, A. (2005). Adhesion strength of the epoxy polymer/copper interface for use in microelectronics. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 152(6), 442.
Chicago author-date
Siau, Sam, Alfons Vervaet, L VAN VAECK, Etienne Schacht, Ulric Demeter, and André Van Calster. 2005. “Adhesion Strength of the Epoxy Polymer/Copper Interface for Use in Microelectronics.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY 152 (6): 442.
Chicago author-date (all authors)
Siau, Sam, Alfons Vervaet, L VAN VAECK, Etienne Schacht, Ulric Demeter, and André Van Calster. 2005. “Adhesion Strength of the Epoxy Polymer/Copper Interface for Use in Microelectronics.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY 152 (6): 442.
Vancouver
1.
Siau S, Vervaet A, VAN VAECK L, Schacht E, Demeter U, Van Calster A. Adhesion strength of the epoxy polymer/copper interface for use in microelectronics. JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 2005;152(6):442.
IEEE
[1]
S. Siau, A. Vervaet, L. VAN VAECK, E. Schacht, U. Demeter, and A. Van Calster, “Adhesion strength of the epoxy polymer/copper interface for use in microelectronics,” JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 152, no. 6, p. 442, 2005.
@article{363941,
  author       = {{Siau, Sam and Vervaet, Alfons and VAN VAECK, L and Schacht, Etienne and Demeter, Ulric and Van Calster, André}},
  issn         = {{0013-4651}},
  journal      = {{JOURNAL OF THE ELECTROCHEMICAL SOCIETY}},
  language     = {{und}},
  number       = {{6}},
  pages        = {{C442-C455}},
  publisher    = {{ELECTROCHEMICAL SOC INC}},
  title        = {{Adhesion strength of the epoxy polymer/copper interface for use in microelectronics}},
  volume       = {{152}},
  year         = {{2005}},
}
Web of Science
Times cited: