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Mechanical FEM simulation of bonding process on Cu lowk wafers

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Chicago
Degryse, Dominiek, Barbra Vandevelde, and E BEYNE. 2004. “Mechanical FEM Simulation of Bonding Process on Cu Lowk Wafers.” Ieee Transactions on Components and Packaging Technologies 27 (4): 643–650.
APA
Degryse, D., Vandevelde, B., & BEYNE, E. (2004). Mechanical FEM simulation of bonding process on Cu lowk wafers. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 27(4), 643–650.
Vancouver
1.
Degryse D, Vandevelde B, BEYNE E. Mechanical FEM simulation of bonding process on Cu lowk wafers. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC; 2004;27(4):643–50.
MLA
Degryse, Dominiek, Barbra Vandevelde, and E BEYNE. “Mechanical FEM Simulation of Bonding Process on Cu Lowk Wafers.” IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 27.4 (2004): 643–650. Print.
@article{351567,
  author       = {Degryse, Dominiek and Vandevelde, Barbra and BEYNE, E},
  issn         = {1521-3331},
  journal      = {IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES},
  language     = {eng},
  number       = {4},
  pages        = {643--650},
  publisher    = {IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC},
  title        = {Mechanical FEM simulation of bonding process on Cu lowk wafers},
  volume       = {27},
  year         = {2004},
}

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