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The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) and Daniël Baert
(2005) Program of the Fifth International Symposium on Polymer Surface Modification. p.22-22
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Citation

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MLA
Siau, Sam, et al. “The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and Its Relevance to Adhesion of Electrochemically Deposited Copper.” Program of the Fifth International Symposium on Polymer Surface Modification, 2005, pp. 22–22.
APA
Siau, S., Vervaet, A., Van Calster, A., & Baert, D. (2005). The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper. Program of the Fifth International Symposium on Polymer Surface Modification, 22–22.
Chicago author-date
Siau, Sam, Alfons Vervaet, André Van Calster, and Daniël Baert. 2005. “The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and Its Relevance to Adhesion of Electrochemically Deposited Copper.” In Program of the Fifth International Symposium on Polymer Surface Modification, 22–22.
Chicago author-date (all authors)
Siau, Sam, Alfons Vervaet, André Van Calster, and Daniël Baert. 2005. “The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and Its Relevance to Adhesion of Electrochemically Deposited Copper.” In Program of the Fifth International Symposium on Polymer Surface Modification, 22–22.
Vancouver
1.
Siau S, Vervaet A, Van Calster A, Baert D. The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper. In: Program of the Fifth International Symposium on Polymer Surface Modification. 2005. p. 22–22.
IEEE
[1]
S. Siau, A. Vervaet, A. Van Calster, and D. Baert, “The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper,” in Program of the Fifth International Symposium on Polymer Surface Modification, 2005, pp. 22–22.
@inproceedings{336375,
  author       = {{Siau, Sam and Vervaet, Alfons and Van Calster, André and Baert, Daniël}},
  booktitle    = {{Program of the Fifth International Symposium on Polymer Surface Modification}},
  language     = {{und}},
  pages        = {{22--22}},
  title        = {{The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper}},
  year         = {{2005}},
}