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Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) and André Van Calster (UGent)
(2005) Meeting abstracts of the 207th Meeting 2005 The Electrochemical Society.. p.348-348
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MLA
Siau, Sam, et al. “Interface Evolution of Epoxy Layers Due to Wetchemical Treatments and Its Relevance to Adhesion of Electrochemically Deposited Copper.” Meeting Abstracts of the 207th Meeting 2005 The Electrochemical Society., 2005, pp. 348–348.
APA
Siau, S., Vervaet, A., Schacht, E., & Van Calster, A. (2005). Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper. Meeting Abstracts of the 207th Meeting 2005 The Electrochemical Society., 348–348.
Chicago author-date
Siau, Sam, Alfons Vervaet, Etienne Schacht, and André Van Calster. 2005. “Interface Evolution of Epoxy Layers Due to Wetchemical Treatments and Its Relevance to Adhesion of Electrochemically Deposited Copper.” In Meeting Abstracts of the 207th Meeting 2005 The Electrochemical Society., 348–348.
Chicago author-date (all authors)
Siau, Sam, Alfons Vervaet, Etienne Schacht, and André Van Calster. 2005. “Interface Evolution of Epoxy Layers Due to Wetchemical Treatments and Its Relevance to Adhesion of Electrochemically Deposited Copper.” In Meeting Abstracts of the 207th Meeting 2005 The Electrochemical Society., 348–348.
Vancouver
1.
Siau S, Vervaet A, Schacht E, Van Calster A. Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper. In: Meeting abstracts of the 207th Meeting 2005 The Electrochemical Society. 2005. p. 348–348.
IEEE
[1]
S. Siau, A. Vervaet, E. Schacht, and A. Van Calster, “Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper,” in Meeting abstracts of the 207th Meeting 2005 The Electrochemical Society., 2005, pp. 348–348.
@inproceedings{336371,
  author       = {{Siau, Sam and Vervaet, Alfons and Schacht, Etienne and Van Calster, André}},
  booktitle    = {{Meeting abstracts of the 207th Meeting 2005 The Electrochemical Society.}},
  language     = {{eng}},
  pages        = {{348--348}},
  title        = {{Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper}},
  year         = {{2005}},
}