Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
- Author
- Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , S DEGRANDE, Katrien Callewaert and André Van Calster (UGent)
- Organization
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-325215
- MLA
- Siau, Sam, et al. “Chemical Modification of Buildup Epoxy Surfaces for Altering the Adhesion of Electrochemically Deposited Copper.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 152, no. 9, ELECTROCHEMICAL SOC INC, 2005, p. 136.
- APA
- Siau, S., Vervaet, A., Schacht, E., DEGRANDE, S., Callewaert, K., & Van Calster, A. (2005). Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 152(9), 136.
- Chicago author-date
- Siau, Sam, Alfons Vervaet, Etienne Schacht, S DEGRANDE, Katrien Callewaert, and André Van Calster. 2005. “Chemical Modification of Buildup Epoxy Surfaces for Altering the Adhesion of Electrochemically Deposited Copper.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY 152 (9): 136.
- Chicago author-date (all authors)
- Siau, Sam, Alfons Vervaet, Etienne Schacht, S DEGRANDE, Katrien Callewaert, and André Van Calster. 2005. “Chemical Modification of Buildup Epoxy Surfaces for Altering the Adhesion of Electrochemically Deposited Copper.” JOURNAL OF THE ELECTROCHEMICAL SOCIETY 152 (9): 136.
- Vancouver
- 1.Siau S, Vervaet A, Schacht E, DEGRANDE S, Callewaert K, Van Calster A. Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper. JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 2005;152(9):136.
- IEEE
- [1]S. Siau, A. Vervaet, E. Schacht, S. DEGRANDE, K. Callewaert, and A. Van Calster, “Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper,” JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 152, no. 9, p. 136, 2005.
@article{325215,
author = {{Siau, Sam and Vervaet, Alfons and Schacht, Etienne and DEGRANDE, S and Callewaert, Katrien and Van Calster, André}},
issn = {{0013-4651}},
journal = {{JOURNAL OF THE ELECTROCHEMICAL SOCIETY}},
language = {{eng}},
number = {{9}},
pages = {{D136-D150}},
publisher = {{ELECTROCHEMICAL SOC INC}},
title = {{Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper}},
volume = {{152}},
year = {{2005}},
}