Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components
- Author
- Kamalpreet Kaur (UGent) , Jeroen Missinne (UGent) , Bjorn Vandecasteele (UGent) , Geert Van Steenberge (UGent) , Sandeep Perinchery, Edsger Smits and Rajesh Mandamparabil
- Organization
- Abstract
- We report the Laser-Induced Forward Transfer (LIFT) of micro-bumps of silver nanoparticle and solder based paste for flip-chip bonding of single VCSEL chips. The electrical characterization results of the bonded chips are also presented.
- Keywords
- LIFT, Flip chip
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-3223573
- MLA
- Kaur, Kamalpreet, et al. “Laser-Induced Forward Transfer-Assisted Flip-Chip Bonding of Optoelectronic Components.” 2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC), IEEE, 2013.
- APA
- Kaur, K., Missinne, J., Vandecasteele, B., Van Steenberge, G., Perinchery, S., Smits, E., & Mandamparabil, R. (2013). Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components. 2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC). Presented at the Conference on Lasers and Electro-Optics Europe & International Quantum Electronics Conference (CLEO/Europe-IQEC), Munich, Germany.
- Chicago author-date
- Kaur, Kamalpreet, Jeroen Missinne, Bjorn Vandecasteele, Geert Van Steenberge, Sandeep Perinchery, Edsger Smits, and Rajesh Mandamparabil. 2013. “Laser-Induced Forward Transfer-Assisted Flip-Chip Bonding of Optoelectronic Components.” In 2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC). IEEE.
- Chicago author-date (all authors)
- Kaur, Kamalpreet, Jeroen Missinne, Bjorn Vandecasteele, Geert Van Steenberge, Sandeep Perinchery, Edsger Smits, and Rajesh Mandamparabil. 2013. “Laser-Induced Forward Transfer-Assisted Flip-Chip Bonding of Optoelectronic Components.” In 2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC). IEEE.
- Vancouver
- 1.Kaur K, Missinne J, Vandecasteele B, Van Steenberge G, Perinchery S, Smits E, et al. Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components. In: 2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC). IEEE; 2013.
- IEEE
- [1]K. Kaur et al., “Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components,” in 2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC), Munich, Germany, 2013.
@inproceedings{3223573, abstract = {{We report the Laser-Induced Forward Transfer (LIFT) of micro-bumps of silver nanoparticle and solder based paste for flip-chip bonding of single VCSEL chips. The electrical characterization results of the bonded chips are also presented.}}, author = {{Kaur, Kamalpreet and Missinne, Jeroen and Vandecasteele, Bjorn and Van Steenberge, Geert and Perinchery, Sandeep and Smits, Edsger and Mandamparabil, Rajesh}}, booktitle = {{2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC)}}, keywords = {{LIFT,Flip chip}}, language = {{eng}}, location = {{Munich, Germany}}, pages = {{1}}, publisher = {{IEEE}}, title = {{Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components}}, year = {{2013}}, }