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Abstract
We report the Laser-Induced Forward Transfer (LIFT) of micro-bumps of silver nanoparticle and solder based paste for flip-chip bonding of single VCSEL chips. The electrical characterization results of the bonded chips are also presented.
Keywords
LIFT, Flip chip

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Citation

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Chicago
Kaur, Kamalpreet, Jeroen Missinne, Bjorn Vandecasteele, Geert Van Steenberge, Sandeep Perinchery, Edsger Smits, and Rajesh Mandamparabil. 2013. “Laser-induced Forward Transfer-assisted Flip-chip Bonding of Optoelectronic Components.” In 2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC). IEEE.
APA
Kaur, Kamalpreet, Missinne, J., Vandecasteele, B., Van Steenberge, G., Perinchery, S., Smits, E., & Mandamparabil, R. (2013). Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components. 2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC). Presented at the Conference on Lasers and Electro-Optics Europe & International Quantum Electronics Conference (CLEO/Europe-IQEC), IEEE.
Vancouver
1.
Kaur K, Missinne J, Vandecasteele B, Van Steenberge G, Perinchery S, Smits E, et al. Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components. 2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC). IEEE; 2013.
MLA
Kaur, Kamalpreet, Jeroen Missinne, Bjorn Vandecasteele, et al. “Laser-induced Forward Transfer-assisted Flip-chip Bonding of Optoelectronic Components.” 2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC). IEEE, 2013. Print.
@inproceedings{3223573,
  abstract     = {We report the Laser-Induced Forward Transfer (LIFT) of micro-bumps of silver nanoparticle and solder based paste for flip-chip bonding of single VCSEL chips. The electrical characterization results of the bonded chips are also presented.},
  author       = {Kaur, Kamalpreet and Missinne, Jeroen and Vandecasteele, Bjorn and Van Steenberge, Geert and Perinchery, Sandeep and Smits, Edsger and Mandamparabil, Rajesh},
  booktitle    = {2013 CONFERENCE ON AND INTERNATIONAL QUANTUM ELECTRONICS CONFERENCE LASERS AND ELECTRO-OPTICS EUROPE (CLEO EUROPE/IQEC)},
  language     = {eng},
  location     = {Munich, Germany},
  pages        = {1},
  publisher    = {IEEE},
  title        = {Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components},
  year         = {2013},
}

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