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Gold nanoplating as a new method for the quantification of the electrochemical activity of grain boundaries in polycrystalline metals

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Keywords
Grain boundaries, Electrochemical activity, Copper, Nanoplating, CU, ENERGIES, DEPOSITION, ALLOY

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Citation

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Chicago
Gaggiano, Roberto, EM Lombardia, I De Graeve, Linsey Lapeire, Kim Verbeken, Leo Kestens, and H Terryn. 2012. “Gold Nanoplating as a New Method for the Quantification of the Electrochemical Activity of Grain Boundaries in Polycrystalline Metals.” Electrochemistry Communications 24: 97–99.
APA
Gaggiano, R., Lombardia, E., De Graeve, I., Lapeire, L., Verbeken, K., Kestens, L., & Terryn, H. (2012). Gold nanoplating as a new method for the quantification of the electrochemical activity of grain boundaries in polycrystalline metals. ELECTROCHEMISTRY COMMUNICATIONS, 24, 97–99.
Vancouver
1.
Gaggiano R, Lombardia E, De Graeve I, Lapeire L, Verbeken K, Kestens L, et al. Gold nanoplating as a new method for the quantification of the electrochemical activity of grain boundaries in polycrystalline metals. ELECTROCHEMISTRY COMMUNICATIONS. 2012;24:97–9.
MLA
Gaggiano, Roberto, EM Lombardia, I De Graeve, et al. “Gold Nanoplating as a New Method for the Quantification of the Electrochemical Activity of Grain Boundaries in Polycrystalline Metals.” ELECTROCHEMISTRY COMMUNICATIONS 24 (2012): 97–99. Print.
@article{3209887,
  author       = {Gaggiano, Roberto and Lombardia, EM and De Graeve, I and Lapeire, Linsey and Verbeken, Kim and Kestens, Leo and Terryn, H},
  issn         = {1388-2481},
  journal      = {ELECTROCHEMISTRY COMMUNICATIONS},
  keyword      = {Grain boundaries,Electrochemical activity,Copper,Nanoplating,CU,ENERGIES,DEPOSITION,ALLOY},
  language     = {eng},
  pages        = {97--99},
  title        = {Gold nanoplating as a new method for the quantification of the electrochemical activity of grain boundaries in polycrystalline metals},
  url          = {http://dx.doi.org/10.1016/j.elecom.2012.08.004},
  volume       = {24},
  year         = {2012},
}

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