Packaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chip
- Author
- Olivier Rits, Ronny Bockstaele and Roel Baets (UGent)
- Organization
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-317196
- MLA
- Rits, Olivier, et al. “Packaging Solution with a 3-Dimensional Coupling Scheme for Direct Optical Interconnects to the Chip.” Proceedings Symposium IEEE/LEOS Benelux Chapter, 2004, pp. 267–70.
- APA
- Rits, O., Bockstaele, R., & Baets, R. (2004). Packaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chip. Proceedings Symposium IEEE/LEOS Benelux Chapter, 267–270.
- Chicago author-date
- Rits, Olivier, Ronny Bockstaele, and Roel Baets. 2004. “Packaging Solution with a 3-Dimensional Coupling Scheme for Direct Optical Interconnects to the Chip.” In Proceedings Symposium IEEE/LEOS Benelux Chapter, 267–70.
- Chicago author-date (all authors)
- Rits, Olivier, Ronny Bockstaele, and Roel Baets. 2004. “Packaging Solution with a 3-Dimensional Coupling Scheme for Direct Optical Interconnects to the Chip.” In Proceedings Symposium IEEE/LEOS Benelux Chapter, 267–270.
- Vancouver
- 1.Rits O, Bockstaele R, Baets R. Packaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chip. In: Proceedings Symposium IEEE/LEOS Benelux Chapter. 2004. p. 267–70.
- IEEE
- [1]O. Rits, R. Bockstaele, and R. Baets, “Packaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chip,” in Proceedings Symposium IEEE/LEOS Benelux Chapter, 2004, pp. 267–270.
@inproceedings{317196,
author = {{Rits, Olivier and Bockstaele, Ronny and Baets, Roel}},
booktitle = {{Proceedings Symposium IEEE/LEOS Benelux Chapter}},
isbn = {{9076546061}},
language = {{und}},
pages = {{267--270}},
title = {{Packaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chip}},
year = {{2004}},
}